519903B00000G

Series:	--
Part Status:	Active
Type:	Board Level
Package Cooled:	TO-3
Attachment Method:	Bolt On
Shape:	Rhombus
Length:	1.550" (39.37mm)
Width:	1.550" (39.37mm)
Diameter:	--
Height Off Base (Height of Fin):	2.000" (50.80mm)
Power Dissipation @ Temperature Rise:	5.0W @ 30°C
Thermal Resistance @ Forced Air Flow:	3.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	4.20°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal-Heat Sinks are essential components for many consumer electronic systems. The 519903B00000G is a thermoelectric heat sink designed specifically for use in very demanding applications such as automotive, robotics, and aerospace. Developed by Japanese manufacturer Furukawa Electric Co., the 519903B00000G provides optimal thermal management for high power devices such as Transistors, Integrated Circuit Boards, and Diodes.The 519903B00000G is constructed of special aluminum alloys that maximize heat dissipation. The material’s high thermal control capacity guarantees efficient cooling of the devices it is connected to. The individual components are machined with a precise cut and shape to ensure perfect thermal conduction. The heat sink effectively dissipates heat from the device to the air, thus reducing the temperature of the device.The working principle of the 519903B00000G is simple. Heat is generated by high-powered electrical components, such as transistors and integrated circuit boards. This heat is conducted away from the device either by conduction, or by convection through a heat exchange material. In the case of the 519903B00000G, the heat is conducted away from the device by the heat sink. The heat produced within the device is absorbed by the metal components of the heat sink. The heat is then dissipated into the surrounding air. This prevents the device from overheating and helps it to operate at optimal temperatures.The 519903B00000G is an ideal solution for high power applications such as automotive, robotics, and aerospace. The material properties of the aluminum alloys ensure efficient heat dissipation, while the precision-machined components guarantee perfect thermal conduction. As a result, the device it is connected to operates at optimal temperatures, leading to increased performance and reliability. In addition, the heat sink is resistant to corrosion, ensuring long-term product reliability.The 519903B00000G is a cost-effective and reliable solution for thermal management of high power devices. By providing optimal thermal management for devices, it ensures reliable and long-term performance. Furthermore, the efficient heat dissipation provided by the aluminum alloys helps reduce the operating temperatures of devices, thus increasing their efficiency and prolonging their lifespan. Overall, the 519903B00000G is a great choice for demanding applications.

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