Allicdata Part #: | 523002B00000-ND |
Manufacturer Part#: |
523002B00000G |
Price: | $ 0.49 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | HEATSINK TO-220 W/TAB BLACK |
More Detail: | Heat Sink TO-220 Aluminum 1.0W @ 20°C Board Level,... |
DataSheet: | 523002B00000G Datasheet/PDF |
Quantity: | 10517 |
1 +: | $ 0.44730 |
10 +: | $ 0.42462 |
25 +: | $ 0.40345 |
50 +: | $ 0.39274 |
100 +: | $ 0.38745 |
250 +: | $ 0.36094 |
500 +: | $ 0.33970 |
1000 +: | $ 0.30785 |
5000 +: | $ 0.29723 |
Specifications
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.180" (29.97mm) |
Width: | 1.000" (25.40mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 1.0W @ 20°C |
Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 300 LFM |
Thermal Resistance @ Natural: | 13.60°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
<p>A thermal heat sink is an important device in any device that relies on efficient heat dissipation. Heat sinks are components used to increase the thermal efficiency of electronic components, by cooling them by dissipating the heat away from the component. The 523002B00000G heat sink is one example of a heat sink that is widely utilized for many different applications.</p><p>The 523002B00000G heat sink is a general-purpose extruded heat sink that is made from aluminum. This design allows for maximum surface area and thus maximum heat dissipation. The aluminum body also acts as a thermal conductor, allowing heat to transfer from the component to the heat sink itself. The device has four mounting holes and a square or rectangular design. The fins of the heat sink are arranged closely together, increasing the surface area and thus maximizing the heat dissipation. The heat sink also features vent holes which increase the efficiency of the device by improving the air circulation within the device. </p><p>The 523002B00000G thermal-heat sink is ideal for use in applications where heat dissipation is necessary and where optimization of the air circulation is necessary to ensure optimal heat removal. These applications may include automotive electronics, audio/video components, computers, gaming consoles, TVs, medical equipment, LED signage and other applications where heat dissipating components are present. This heat sink has a relatively small size and low profile, which makes it suitable for most applications, where size and weight are critical.</p><p>The 523002B00000G thermal-heat sink works on the principle of conduction and convection. It is designed to efficiently transfer the heat away from the component to the heat sink. The aluminum body of the heat sink conducts the heat away from the component to the heat sink, while the air flow passing through the fins remove the heat from the sink. The aluminum also acts as a heat sink, preventing the heat from escaping back to the components.</p><p>The 523002B00000G heat sink is designed for use in a variety of applications where extreme temperatures are present. It is also designed to provide efficient and reliable heat dissipation. The device has a relatively small size and low profile, making it ideal for applications where space is at a premium. The device also comes with four mounting holes, making it easy to mount and secure.</p><p>The 523002B00000G thermal-heat sink is suitable for use in a variety of applications where thermal management is important. This device is ideal for automotive electronics, audio/video components, computers, gaming consoles, TVs, medical equipment, LED signage, and other applications where heat dissipating components are present. Its relatively small size and low profile make it suitable for applications where size and weight are critical.</p>The specific data is subject to PDF, and the above content is for reference
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