
Allicdata Part #: | 529801B02100G-ND |
Manufacturer Part#: |
529801B02100G |
Price: | $ 0.85 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-218 Aluminum 5.0W @ 30°C Board Level,... |
DataSheet: | ![]() |
Quantity: | 1000 |
3500 +: | $ 0.77087 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-218 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.500" (38.10mm) |
Width: | 1.650" (41.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | 5.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 5.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Heat sinks are a type of heat transfer device used to cool the temperature of electronics or other components. Heat sinks are designed to draw heat away from the surface on which they are mounted. The 529801B02100G thermal-heat sink is designed for a range of commercial applications and power electronic systems. Its main purpose is to absorb the heat generated by a system, enabling it to operate at lower temperatures for a longer period of time while also reducing the risk of overheating and component damage.
The 529801B02100G thermal-heat sink is made of aluminum with a black anodized finish. Its design typically includes a fin-like arrangement of fins that enables greater heat transfer efficiency. The fins are designed with a wavy inner shape in order to increase the surface area and provide more contact with the air so that a greater amount of heat can be dissipated. The fins are also designed to be lightweight and easy to assemble.
The 529801B02100G thermal-heat sink has a maximum airflow rate of 1.5 cubic feet per minute (CFM). This is enough airflow to keep the device from overheating and will also help reduce electrical noise. The built-in fan can be used to further cool the system. It also has a clip-on design that makes installation quick and easy.
The 529801B02100G thermal-heat sink works on a principle of convection. As the hot air comes into contact with the fins, it rises and cools the device. As the hot air rises, it causes a vacuum that draws cool air in. This cool air is then drawn up and through the fins to cool the device.
The 529801B02100G thermal-heat sink is typically used in a variety of commercial applications, including data centers, telecommunications, automation equipment, and industrial and automotive electronics. It is also used in power electronics. The device is highly efficient and easy to install, making it an ideal choice for cooling electronic components.
In summary, the 529801B02100G thermal-heat sink is a robust and reliable device that is designed to provide effective cooling for a wide range of commercial applications and power electronic systems. Its lightweight and easy to install design makes it the perfect choice for cooling electronic components. The 529801B02100G thermal-heat sink works on the principle of convection, drawing in hot air to cool the device and dissipating heat quickly and efficiently.
The specific data is subject to PDF, and the above content is for reference
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