Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-218
Attachment Method:	Bolt On and PC Pin
Shape:	Rectangular, Fins
Length:	2.500" (63.50mm)
Width:	1.650" (41.91mm)
Diameter:	--
Height Off Base (Height of Fin):	1.000" (25.40mm)
Power Dissipation @ Temperature Rise:	20.0W @ 60°C
Thermal Resistance @ Forced Air Flow:	1.00°C/W @ 800 LFM
Thermal Resistance @ Natural:	8.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

Thermal heat sinks are essential components used in many electronic circuits. They function as radiators and allow heat to dissipate from components that generate high levels of heat. Heat sinks offer physical protection for the components, as well as forcing the air around the component to flow so that heat is extracted more efficiently. In this article, we explore the application field and working principle of 530001B02100G thermal heat sinks.

Application Field

530001B02100G thermal heat sinks are offered by Sunpower Technology and are designed for domestic electrical and electronic devices such as televisions, AC/DC adaptors, or computers.These heat sinks are made of anodized aluminum and feature a pin design. The pins on the heat sinks are designed to increase heat dissipation by allowing the air to flow freely around the component. This type of thermal heat sink is widely used in many electronic devices and is perfect for use in products that require efficient heat transfer.With a thermal resistance of 0.7 °C/W, these thermal heat sinks are suitable for applications where thermal performance is important. In addition, they have an operating temperature range of -40 °C to 85 °C and a maximum power dissipation of 10 W.

Working Principle

The 530001B02100G thermal heat sinks work on a simple principle. These heat sinks are designed to transfer heat from the component using convection. The heat sinks are designed with pins to allow the air to circulate around the component and dissipate heat more efficiently.Convection is the process by which heat is transported from one area to another. Hot air rises and cool air falls. As the hot air rises around the heat sink pins, more air is drawn in towards the bottom of the heat sink pins, creating a continuous flow of air. The flow of air draws heat away from the component, allowing it to remain cool.Additionally, 530001B02100G thermal heat sinks use conduction to transfer excess heat away from the component. The pins on the heat sink act as a conductor, allowing heat to pass through them and into the ambient air, allowing the component to remain cool.

Conclusion

530001B02100G thermal heat sinks are an important component in many electronic devices. They are designed to effectively dissipate heat from components that generate high levels of heat, protecting them from damage and extending their lifespan. The heat sinks transfer the heat using a combination of convection and conduction, allowing the component to remain cool and ensuring that it performs optimally.

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