Allicdata Part #: | 531202B02100G-ND |
Manufacturer Part#: |
531202B02100G |
Price: | $ 1.23 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | HEATSINK TO-220 SOLDERPIN 50.8MM |
More Detail: | Heat Sink TO-220, TO-202 Aluminum 8.0W @ 60°C Boar... |
DataSheet: | 531202B02100G Datasheet/PDF |
Quantity: | 2113 |
1 +: | $ 1.11510 |
10 +: | $ 1.06155 |
25 +: | $ 1.03370 |
50 +: | $ 1.00586 |
100 +: | $ 0.94998 |
250 +: | $ 0.89410 |
500 +: | $ 0.83822 |
1000 +: | $ 0.78233 |
5000 +: | $ 0.75440 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220, TO-202 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 2.000" (50.80mm) |
Width: | 1.375" (34.93mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 8.0W @ 60°C |
Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 600 LFM |
Thermal Resistance @ Natural: | 7.50°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks
Thermal management is essential in the electronics industry, so it requires heat sinks to regulate temperatures. A key aspect of this is the 531202B02100G heat sink.
This product features a compact form factor, as well as a low thermal resistance. Moreover, it can be used in a wide range of applications, such as computers, medical equipment, consumer products, telecommunication, automotive electronics, and power supplies.
The 531202B02100G can help reduce the system\'s temperature, which improves its reliability and stability. It is made from aluminum and can effectively dissipate heat from a variety of heat sources.
This product also has a high thermal conductivity and is lightweight and easy to install. Moreover, it is resistant to corrosion, dust, and moisture, making it ideal for outdoor applications.
The 531202B02100G is a heat sink designed to manage heat and reduce system temperature. It has a high thermal conductivity and a low thermal resistance and can be used in a variety of different industrial and commercial applications. It is lightweight and easy to install, and it is resistant to dust, moisture, and corrosion.
The working principle behind a heat sink is based on the thermal dynamics of heat transfer. Heat is generated from a variety of sources such as CPU, GPUs, power supplies, and other components. The heat generated travels through the cables and components to the heat sink where it is dissipated. The heat sink is designed to efficiently absorb heat and transfer it away from the system in a safe manner.
The heat sinks are designed in such a way that heat is conducted away from the components, allowing the components to stay at a stable temperature. A fan may be used in combination with a heat sink to further enhance the thermal transfer rate. It is also important to use proper thermal paste or thermal pads in order to ensure efficient heat transfer.
In conclusion, the 531202B02100G heat sink is an effective and efficient solution for cooling electronics. It is lightweight, easy to install, and resistant to dust, moisture, and corrosion. It also has a high thermal conductivity and low thermal resistance. The working principle is based on thermal dynamics and heat transfer, and it can be used in a variety of different industrial and commercial applications.
The specific data is subject to PDF, and the above content is for reference
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