532901-3

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Backplane connectors are almost exclusively used in the data communication industry to link backplane systems in pursuit of system stability and transmission speed. The 532901-3 backplane connector is a specialized device developed to offer high-density backplane connection and durability under harsh environment.

The 532901-3 utilizes a 120-position (120p) design in a 0.8mm pitch format. As one of the world\'s smallest, most compact backplane connectors, it has a total edge card connector length of only 42.35mm, enough to fit in a standard 1U-height system. Many of today\'s modern computing communication systems have extremely limited space within their design space, and this backplane connector is designed to provide the highest level of integration and connection for these types of systems, making the 532901-3 the best choice to achieve high-density backplane connection in restricted design areas.

To meet the needs of the data communication industry, the 532901-3 is developed to withstand harsh conditions, providing superior durability for a prolonged service life. By introducing a unique “floating pin” design, the 532901-3 has become one of the most reliable backplane connectors on the market. Through its combined elasticity and flexibility, it is able to absorb between 7500 and 8000 mating cycles, nearly double than traditional backplane connectors, while also providing 0.4dB higher cross talk noise margin and lower contact resistance. Additionally, the amount of power needed to complete the cross mating between the three connectors of the 532901-3 is highly reduced, making it ideal for applications in larger ATE systems.

As for its working principle, the 532901-3 backplane connection makes use of a cluster contact mechanism design, which includes a rotating beam and a floating pin that are placed between the receptacle and the contacts. This allows for superior performance as the floating pin eliminates any material contact, ensuring the reliability of the connection even under a significant amount of stress. Moreover, the 532901-3 uses a mode conversion structure for its contacts, and both the contact point and the floating point are made of a high-performance alloy, creating a high level of heat dissipation and connector endurance.

With its high-performance and high-density design, the 532901-3 backplane connector offers an ideal solution for a variety of applications. This includes applications in high-speed data transfers, digital chip topology systems, military defense, storage area networking (SAN), factory automation, medical and industrial control. Furthermore, its high mating pulse resistance makes the 532901-3 ideal for testing and validation systems, particularly those with the requirement to conduct numerous tests and ensure perfect connection before products are released.

532901-3 backplane connectors are versatile, reliable and rugged devices designed to facilitate quick and stable data communication through a compact connection platform. Its unique design improves reliability and performance, allowing it to perform even under extreme environmental conditions. In addition, its flexibility and durability make it the optimal choice for many types of applications and architectures.

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