532931-4

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The532931-4 backplane connector is a specialized product in the larger family of backplane connectors. It is a 216-pin, lightweight, low-profile connector specifically designed to operate in data communications networks and similar applications where space is at a premium. It can provide improved electrical performance, reduced EMI emissions, and low signal loss.

The532931-4 is a high-density connector that is design to solve both spacing and electrical performance problems. The connector is optimized and designed to fit into environments with tight space requirements. This makes it perfect for network and embedded computing applications. The contacts on the connector are designed to ensure a high degree of current-carrying capabilities, allowing them to be used for high bandwidth applications.

The532931-4 is comprised of a 216-position contact array and a thermoplastic housing. The contact array is manufactured using precision die-casting technology to provide high reliability electrical performance. The contacts are configured to provide low-impedance signals and more efficient grounding than traditional backplane connectors. The thermoplastic housing is designed to provide maximum protection against dust and moisture ingress. The housing also includes sealing gaskets to reduce the likelihood of corrosion.

The 532931-4 is designed to provide a reliable and secure connection that is also cost-effective and low-profile. The connector utilizes a snap-lock design to ensure a secure connection between the contact array and the mating connector. The contacts are also protected by a latching device to ensure proper connection integrity. The ability to quickly and easily disconnect and reconnect allows for easy maintenance or reconfiguration.

The 532931-4 is designed to operate in high bandwidth applications by providing low signal loss. This is achieved by utilizing precision die-cast contacts that are optimized for high frequency signal transmission. The contacts are also designed to reduce the amount of electrical discontinuity that is caused by impedance mismatch. Additionally, the contact array is designed to reduce the amount of reflected signals, resulting in a more consistent signal.

The 532931-4 is also designed to reduce EMI emissions. This is accomplished by incorporating shielding into the body of the connector. The shield is integrated into the housing and consists of a beryllium-copper material. This material is effective at reducing electromagnetic radiation from the contact array. The shielding also provides increased protection against external EMI sources.

In conclusion, the 532931-4 backplane connector is a specialized connector designed to operate in high-performance data communications networks. It provides a low profile, cost effective solution with improved electrical performance, reduced EMI emissions, and low signal loss. The connector utilizes precision die-cast contacts and a thermoplastic housing for maximum protection from dust and moisture ingress. Additionally, the shielding design reduces the amount of EMI radiation emitted by the connector.

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