533002B02551G

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Clip and PC Pin
Shape:	Rectangular, Fins
Length:	1.000" (25.40mm)
Width:	1.375" (34.93mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	2.0W @ 30°C
Thermal Resistance @ Forced Air Flow:	4.00°C/W @ 400 LFM
Thermal Resistance @ Natural:	13.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction to Thermal - Heat Sinks

Thermal - Heat Sinks are components designed to dissipate, or transfer, the thermal energy generated by electronic components into the surrounding environment. They are commonly used in computers, circuit boards and other electronic devices to reduce the overall heat level around the component they are connected to. Heat sinks are usually made of an aluminum or copper base that helps to absorb heat from the surrounding atmosphere. They are then attached to the components, which transfers the thermal energy into the surrounding environment.

The 533002B02551G

The 533002B02551G is a thermal - heat sink specifically designed for use in the computer industry. It features a highly efficient heat dissipation pedestal for maximum performance when it is connected to a heat-dissipating device such as a CPU or GPU. The base is made of high quality aluminum, which is an excellent heat conductor and offers superior thermal transfer properties. The fin pattern of the 533002B02551G Heat Sink allows for excellent airflow, ensuring that it remains cooled even when used for extended periods of time.

Application Field and Working Principle

The 533002B02551G thermal - heat sink is designed for applications such as general purpose computers, PCs, servers, video cards, audio cards and graphics cards. When connected to a device, the base absorbs the thermal energy that is generated by the device, while the fin pattern helps to disperse the heat throughout the surrounding environment. The 533002B02551G also features a low-profile design for added convenience and space efficiency.When connected to a device, the heat generated by the device is passed through the heat sink into the surrounding air. The fin pattern on the heat sink allows the thermal energy to be spread evenly, so that it dissipates from the base into the surrounding air quickly and efficiently. This process helps to keep the heat levels within the device\'s safe operating range, and it helps to reduce the risk of overheating and damaging the device.

Conclusion

The 533002B02551G thermal - heat sink is an important component of any computer system, as it helps to keep the device’s temperature within safe levels. It is designed with a highly efficient heat dissipation pedestal and features an aluminum or copper base which absorbs heat from the device and dissipates it throughout the surroundings. The fin pattern of the heat sink ensures that the device remains cooled and safe. The 533002B02551G is a great solution for any device looking to maintain performance in the long-term.

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