Allicdata Part #: | 552803B00000G-ND |
Manufacturer Part#: |
552803B00000G |
Price: | $ 0.95 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-3 Aluminum 2.0W @ 20°C Board Level |
DataSheet: | 552803B00000G Datasheet/PDF |
Quantity: | 1000 |
5000 +: | $ 0.84984 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-3 |
Attachment Method: | Bolt On |
Shape: | Square, Fins |
Length: | 1.780" (45.21mm) |
Width: | 1.780" (45.21mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.750" (19.05mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 20°C |
Thermal Resistance @ Forced Air Flow: | 2.50°C/W @ 400 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are widely used across a wide range of applications, from consumer electronic devices to industrial machines. The demand for better heat sinks with higher performance, longer lifespan and improved safety features are continuously increasing due to dynamically changing environment and requirements.The 552803B00000G is a model of a specific type of heat sink and is commonly referred to as a “square fin” heat sink. This heatsink features an elegantly designed aluminum extrusion with highly effective aluminum fins that offers exceptional heat transfer performance. The high thermal properties of the aluminum used in these heat sinks allow for excellent thermal dissipation over larger surfaces, making it perfect for larger applications such as cooling PC or server hardware.The total height of the 552803B00000G heat sink is 52.6mm with an extruded base area of 280 mm by 130 mm. It consists of twenty extruded aluminum fins with a thickness of 0.7mm. The fins have an increased area of 155mm2 to ensure maximum heat transfer capability.The 552803B00000G heat sink has a broad variety of application fields, ranging from electronic cooling needs, to industrial machinery, to general cooling applications. It is especially suitable for cooling highly heat-generating components such as computer processors and memory. The working principle of the 552803B00000G heat sink is quite simple. The aluminum fins spread out the heat away from the cold plate, and by convection, the warm air flows away from the heat sink and is replaced by cooler air to further reduce the temperature. This helps reduce the temperature of the processor and other components, thus preventing overheating and improving performance. This heat sink design offers good cooling with minimal installation complexity, making it a widely used and cost-effective solution for cooling various electronic components. The 552803B00000G thermal heat sink also has a low noise profile with a noise level of less than 25 decibels, making it suitable for applications with noise considerations. The thermal heat sink has a high tolerances of up to 0.1mm, making it suitable for a variety of environment and applications.Overall, the 552803B00000G heat sink is an ideal solution for cooling larger components such as PC or server hardware. It offers excellent heat transfer material with high fin spacing for maximum performance. The heat sink also features low noise operation and high tolerances, making it suitable for various applications. It is a cost-effective choice for cooling of larger electronic components and is often used in large-scale industrial applications.
The specific data is subject to PDF, and the above content is for reference
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