560700B00000

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	40-DIP
Attachment Method:	Press Fit, Slide On
Shape:	Rectangular, Fins
Length:	2.125" (53.97mm)
Width:	1.065" (27.05mm)
Diameter:	--
Height Off Base (Height of Fin):	0.485" (12.32mm)
Power Dissipation @ Temperature Rise:	1.0W @ 20°C
Thermal Resistance @ Forced Air Flow:	7.00°C/W @ 300 LFM
Thermal Resistance @ Natural:	24.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Heat sinks are devices primarily designed to dissipate the heat generated by electronic components, so that they can function optimally in their temperature range. 560700B00000 heat sinks are special kind of heat sink which is an aluminum extrusion, designed to be used in maximum static air flow cooling with little increase in noise. This type of heat sink also provides a wider range of mounting options than other costly heat sinks in the market.

560700B00000 Application Field

560700B00000 heat sinks are used in different cooling environments for a multitude of applications in various industries such as consumer electronics, automotive, telecom, and industrial manufacturing. Heat sink extrusion is a specialized process for producing custom heat sinks and cooling solutions from solid aluminum or copper. This is done by molding the metal into various shapes to improve heat transfer efficiency. The 560700B00000 heat sink extrusion is ideal for applications that require chipsets and processors to run at higher operating temperatures, such as those in automotive and industrial electronics, as well as those in consumer electronics with limited space. This type of heat sink extrusion can accommodate a variety of chipsets, processors, transistors, controllers, sensors, actuators and other devices, giving it the ability to provide a more efficient form of cooling.

560700B00000 Working Principle

The 560700B00000 heat sinks are designed and engineered to maximize the surface area contact with the environment in which the device is situated. This enables the heat to spread out evenly, which results in better heat transfer and higher heat dissipation from the device. In addition, the extruded heat sink has better heat conductivity due to the fact that the metal is milled to a certain thickness. This makes it easier for heat to travel along the walls, ensuring better cooling performance for devices. The 560700B00000 heat sink extrusion also incorporates features like mounting tabs, which enable the optimal placement of the heat sink for maximum cooling potential. The aluminum extrusion also helps reduce fan noise due to its high thermal conductivity, which absorbs the noise generated by the fan and disperses it into the surrounding environment. This ensures a quiet, relaxing computing environment. The 560700B00000 heat sinks also provide a variety of other cooling solutions, such as the use of closed-loop liquid coolers. This type of cooler can be connected directly to a processor or other device, providing an efficient way of cooling the device by removing the heat externally. This can be done with minimal effort and at a much lower cost than a traditional air-cooled system. In conclusion, the 560700B00000 heat sink extrusion provides a cost effective, energy-efficient way to cool electronics. This type of heat sink is designed for static air flow cooling, but also provides a wide range of cooling solutions that can be used in other applications. This heat sink is an ideal choice for applications that require a high level of thermal performance.

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