563002B00000G

Introduction

563002B00000G Thermal - Heat Sinks are designed to provide effective cooling solutions for high performance electronics and systems. These heat sinks are designed to efficiently move heat away from the components and transfer the heat from the component to the surrounding environment. The 563002B00000G can be used in applications such as personal digital assistant (PDA) and embedded systems, servers, advanced digital signal processing (DSP) components, storage components, laser technology, sensors, and high-end industrial applications. The thermal-heat sink is designed with superior thermal performance to ensure reliable operation even under extreme operating conditions.

Design Features

The thermal-heat sinks use a unique design that combines an aluminum extrusion with a thermal conductive polyamide foam. The extrusion allows for a large surface-to-volume ratio, providing excellent heat dissipation through convection. The polyamide foam helps dissipate heat away from warm components to the surrounding environment. This also helps eliminate the need for additional cooling devices such as fans. The thermal-heat sink features a natural anodized finish which provides increased protection against oxide formation.

The 563002B00000G has an open cell structure which helps ensure efficient heat dissipation. This allows air to easily pass through the heat sink, helping to keep internal temperatures down. The thermal-heat sink also uses a durable aluminum construction which is designed to withstand high temperatures and provide reliable performance. The design of the heat sink also includes fins that help draw heat away from the components.

The 563002B00000G thermal-heat sink is designed to be easy to install. No additional tools or hardware are required and the heat sink can be mounted quickly and easily. The heat sink is also compatible with a wide variety of mounting solutions, including snap-in, screw-in, and adhesive-back mounting options.

Application Field and Working Principle

The 563002B00000G Thermal - Heat Sink can be used in a variety of applications where high performance cooling solutions are required. These include systems with high power output requirements, such as advanced digital signal processors, laser technology, sensors and specialized industrial applications. The thermal-heat sink can also be used for application in consumer electronics, such as personal digital assistants, mobile devices, cellular phones, and more.

The 563002B00000G thermal-heat sink is designed to efficiently move heat away from the components and transfer it to the environment. This is achieved through the combination of an aluminum extrusion with a thermal conductive polyamide foam. The extrusion provides excellent thermal conductivity and the foam helps to dissipate heat away from the components. The open cell structure allows air to pass through the heat sink, helping to keep internal temperatures down. The fins draw heat away from the components, and the durable construction ensures reliable performance and longevity.

The 563002B00000G Thermal - Heat Sink is designed to provide reliable and effective cooling solutions for the most demanding environments. The efficient design and easy installation make it an ideal solution for a wide range of applications.