Allicdata Part #: | 563202D00000G-ND |
Manufacturer Part#: |
563202D00000G |
Price: | $ 0.85 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-220 2.0W @ 30°C Board Level, Vertica... |
DataSheet: | 563202D00000G Datasheet/PDF |
Quantity: | 1384 |
1 +: | $ 0.78120 |
10 +: | $ 0.73962 |
25 +: | $ 0.72022 |
50 +: | $ 0.70081 |
100 +: | $ 0.66188 |
250 +: | $ 0.62294 |
500 +: | $ 0.58401 |
1000 +: | $ 0.54508 |
5000 +: | $ 0.52561 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 2.000" (50.80mm) |
Width: | 1.380" (35.05mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 9.40°C/W |
Material: | -- |
Material Finish: | Tin |
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Heat sinks are essential components in a number of technology systems. They help manage heat that is generated by electronic devices or components. The 563202D00000G thermal heat sinks are designed for general-purpose heat dissipation, meaning they are optimized for use in multiple technology systems. This article will explain the application field and working principle of the 563202D00000G heat sinks.
The 563202D00000G heat sinks are designed to be used with a variety of electronic components including CPUs, GPUs, RAM modules, and more. These heat sinks feature a robust aluminum design with a polygon shape and are designed to provide superior cooling technology. The base plate of the 563202D00000G is composed of pure copper, which provides excellent performance benefits. The fins and side panels are made from heat-resistant extruded aluminum, allowing for optimal dissipation of excess heat.
The working principle of the 563202D00000G heat sinks is based on the Kjellman Effect. This cooling effect is based on the principles of thermodynamics and is responsible for helping keep electronic components running smoothly and without overheating. Basically, the Kjellman Effect describes the phenomenon whereby air is forced to move because of the difference in pressure created by heat. When a heat sink is employed, the air is allowed to flow freely, allowing conductor heat to be dissipated away from the heat source. This effect allows for uniform and effective cooling of electronic devices.
The 563202D00000G heat sinks are typically used in a variety of applications, including computers, industrial machinery, and consumer electronics. The Kjellman cooling effect helps maintain a stable level of cooling for various components in a wide range of applications. Additionally, the aluminum design of the 563202D00000G helps dissipate heat away from the component and keeps the temperature in check. The heat dissipation process ensures that the components are kept cool and running smoothly.
The 563202D00000G thermal heat sinks are designed to be used in a variety of technology systems and devices. They are optimized to provide superior cooling performance, helping to keep electronics running at optimal temperatures and conditions. The heat dissipation, based on the Kjellman Effect, allows for uniform and effective cooling of various devices and components.
The specific data is subject to PDF, and the above content is for reference
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