573300D00010G Fans, Thermal Management |
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| Allicdata Part #: | HS338TR-ND |
| Manufacturer Part#: |
573300D00010G |
| Price: | $ 0.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
| Short Description: | HEATSINK D2PAK .4" HIGH SMD |
| More Detail: | Heat Sink TO-263 (D²Pak) Copper 1.3W @ 30°C Top Mo... |
| DataSheet: |  573300D00010G Datasheet/PDF |
| Quantity: | 51000 |
| 250 +: | $ 0.40592 |
| 500 +: | $ 0.38203 |
| 1250 +: | $ 0.34622 |
| 6250 +: | $ 0.33428 |
| 12500 +: | $ 0.31040 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | TO-263 (D²Pak) |
| Attachment Method: | SMD Pad |
| Shape: | Rectangular, Fins |
| Length: | 0.500" (12.70mm) |
| Width: | 1.030" (26.16mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.400" (10.16mm) |
| Power Dissipation @ Temperature Rise: | 1.3W @ 30°C |
| Thermal Resistance @ Forced Air Flow: | 10.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 18.00°C/W |
| Material: | Copper |
| Material Finish: | Tin |
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The 573300D00010G is a type of thermal heat sinks. They are designed to cool electronic components or systems to achieve to maintain optimal performance. These devices are typically constructed from a heat conductive material such as aluminum, copper, or a combination of both materials.
Applications
The 573300D00010G thermal heat sink is used in a variety of applications. They are generally used to dissipate heat from electronic components or systems, such as processors, transistors, diodes, and other similar components. Heat sinks can also be used to prevent thermal runaway, a common problem in high power electronics due to their large heat transfer surface area. This makes them especially useful in applications where a lot of power is dissipated, such as industrial machines, power supplies, and welders.
Advantages
The 573300D00010G thermal heat sinks offer several advantages over traditional air-cooled devices. They are extremely efficient at transferring heat, offering greater cooling performance than air-cooled devices. Heat sinks also require less space than traditional air-cooled devices, making them ideal for applications with limited space requirements. Additionally, because the heat sink is thermally isolated from the electronic component or system, they are also able to provide better protection against EMI/RFI interference.
Disadvantages
The main disadvantage of 573300D00010G thermal heat sinks is that they can be more expensive than air-cooled devices. Heat sinks also require a power source, meaning they are not ideal for applications with limited power requirements. Additionally, they require a good air flow to maximize their efficiency. Finally, the materials used to construct the heat sink have the potential to corrode, which can lower its efficiency and cause thermal transfer losses.
Conclusion
Overall, the 573300D00010G thermal heat sinks are an efficient and cost-effective solution for dissipating heat from electronic components or systems. These heat sinks are designed to provide high thermal conductivity in a small package, making them ideal for applications with limited space requirements. Additionally, they provide better protection against EMI/RFI interference compared to traditional air-cooled devices. However, it is important to ensure that the heat sink is mounted correctly and is adequately cooled by airflow to achieve optimal performance.
The specific data is subject to PDF, and the above content is for reference
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