575200B00000G Allicdata Electronics
Allicdata Part #:

HS251-ND

Manufacturer Part#:

575200B00000G

Price: $ 0.49
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK TO-92 .72" BLK
More Detail: Heat Sink TO-92 Aluminum 0.3W @ 20°C Board Level, ...
DataSheet: 575200B00000G datasheet575200B00000G Datasheet/PDF
Quantity: 5154
1 +: $ 0.44730
10 +: $ 0.42336
25 +: $ 0.40219
50 +: $ 0.39161
100 +: $ 0.38632
250 +: $ 0.35986
500 +: $ 0.33869
1000 +: $ 0.30694
5000 +: $ 0.29635
Stock 5154Can Ship Immediately
$ 0.49
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-92
Attachment Method: Press Fit
Shape: Rectangular, Fins
Length: 0.602" (15.29mm)
Width: --
Diameter: --
Height Off Base (Height of Fin): 0.720" (18.29mm)
Power Dissipation @ Temperature Rise: 0.3W @ 20°C
Thermal Resistance @ Forced Air Flow: 17.50°C/W @ 400 LFM
Thermal Resistance @ Natural: 60.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are being used in a variety of industrial and commercial applications to help control temperature and to protect against environmental and safety related concerns. The 575200B00000G is a type of heat sink which is used to help dissipate heat and reduce the temperature of a component or system. It is composed of a plurality of parallel fins connected together in order to maximize heat transfer to the surrounding environment. This type of heat sink works in conjunction with a fan or other cooling system to help reduce the overall operating temperature of a component.

Typically, a 575200B00000G heat sink is made of aluminum and has a large number of fins that are aligned in order to maximize the area along which heat can be dissipated. The fins are generally connected to a base in order to create a ‘heat sink’ which will provide the maximum surface area for the heat from the component to be transferred. The number of fins, the spacing between the fins, and the material used in the construction of the heat sink will all affect the performance of the heat sink.

The 575200B00000G heat sink provides an effective way to dissipate heat from electronic components such as CPUs and other components. The heat sink helps to reduce the overall temperature of the system which prevents it from overheating. It also helps to provide an efficient cooling system which can help to prolong the life of the components and prevent them from being damaged due to overheating.

Another important aspect of the 575200B00000G Heat Sink is its ability to reduce the amount of power consumption required to operate the system. The heat sink helps to reduce the amount of power wasted in order to cool down the system by allowing a much larger area of contact between the heat generating component and the environment. This in turn helps to reduce the power consumption of the system while at the same time increasing the efficiency of the cooling system. This means that the system can be operated on a much lower power consumption while providing the same level of cooling as a more powerful system.

The 575200B00000G Heat Sink also provides a cost-effective way of cooling a system. The number of fins, spacing between each fin, and the material used to construct the heat sink are all designed to maximize the amount of surface area available for the heat from the component to be transferred and dissipated. This makes the 575200B00000G Heat Sink much more affordable than other cooling components, as well as more efficient.

The 575200B00000G Heat Sink is widely used in a variety of applications and industries. It is used in computers, electronic components, automotive components, medical equipment, and many other applications. The design of the 575200B00000G Heat Sink is such that it is capable of providing an effective cooling solution for components and systems of a wide variety of sizes and types. It is also capable of providing a cost-effective cooling system which is suitable for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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