575603B00000G Fans, Thermal Management |
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Allicdata Part #: | 575603B00000G-ND |
Manufacturer Part#: |
575603B00000G |
Price: | $ 0.90 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-3 Aluminum 3.0W @ 50°C Board Level |
DataSheet: | 575603B00000G Datasheet/PDF |
Quantity: | 1000 |
6000 +: | $ 0.81308 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-3 |
Attachment Method: | Bolt On |
Shape: | Rhombus |
Length: | 1.630" (41.40mm) |
Width: | 1.290" (32.77mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 3.0W @ 50°C |
Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 600 LFM |
Thermal Resistance @ Natural: | 15.60°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 575603B00000G is a thermal heat sink that is designed to help cool electronic equipment and components in order to protect them from damage caused by excessive heat or other external environmental factors. Heat sinks are important for keeping critical components in electronic devices from overheating, and thus ensure that the device is able to run smoothly and operate properly. This particular heat sink is particularly well suited for use in both commercial and industrial applications.
In order to understand how the 575603B00000G works, it is important to first understand heat transfer. Heat transfer is the process of energy transfer from a high-temperature source to a relatively cooler area. In the case of a heat sink, the source of the heat transfer is usually the microchips or other components within the device. The heat sink captures this heat and dissipates it away from the components.
The 575603B00000G uses a passive thermal design, which means it does not require any external power source. This makes the heat sink especially well suited for use in portable devices, as they typically rely on smaller power supplies. The heat sink works by utilizing a combination of natural convection, thermal radiation, and conduction to dissipate the heat from the components, which in turn keeps them from overheating.
The 575603B00000G heat sink is composed of a series of aluminum fins arranged in an array layout. These fins help to increase the surface area of the heat sink so that more of the heat can be dissipated faster. The heat sink also features a die-cast aluminum base which provides added support and helps to stabilize the fins. Additionally, the heat sink is equipped with two mounting holes and hardware, allowing it to be easily secured to most application surfaces.
The 575603B00000G is designed to work with a variety of power supplies and substrate types. It can handle most standard components, as well as many specialty components, and is capable of dissipating up to 15 watts of power. Additionally, it is UL listed and RoHS compliant, providing buyers with the assurance that the heat sink is a safe and reliable solution.
The 575603B00000G is an excellent thermal heat sink solution for a variety of applications. Its passive design and wide compatibility range makes it ideal for use in portable devices and other equipment where space and energy conservation are key. With its UL listing and RoHS compliance, the 575603B00000G is a great choice for anyone who needs a reliable, efficient, and cost-effective heat sink to help keep their electronic components cool.
The specific data is subject to PDF, and the above content is for reference
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