575803B00000G

Series:	--
Part Status:	Active
Type:	Board Level
Package Cooled:	TO-3
Attachment Method:	Bolt On
Shape:	Rhombus
Length:	1.630" (41.40mm)
Width:	1.290" (32.77mm)
Diameter:	--
Height Off Base (Height of Fin):	1.000" (25.40mm)
Power Dissipation @ Temperature Rise:	5.0W @ 50°C
Thermal Resistance @ Forced Air Flow:	3.50°C/W @ 200 LFM
Thermal Resistance @ Natural:	11.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are essential components used in almost all electronics, including computers, game consoles, appliances, cell phones, and other electrical and electronic devices. A heat sink is a device that dissipates heat from an electronic component to a nearby thermal medium like air, water or any other material. Heat sinks are commonly made of aluminum or copper, but they can also be made of other materials like plastic, graphite, and stainless steel. The main purpose of a heat sink is to prevent any overheating from occurring in the electronic component that it is attached to. Without a heat sink, the component would become too hot and eventually be damaged or fail. Heat from a component is dissipated to a thermal medium when the thermal medium makes contact with the heat sink. This contact occurs between the fins or grooves in the heat sink that help to disperse the heat. The specific style and size of a heat sink, as well as the manufacturing material used, are all specific to the application. For instance, the 575803B00000G heat sink is designed for cooling printed circuit board (PCB) applications that require higher thermal performance. This particular heat sink is designed to be used in applications with boards having a limited area for a PCB mounting component. It is 27 x 15 x 16mm in size and made of high-performance aluminum to provide excellent thermal performance and has a thermal resistance of 167°K/W.The 575803B00000G heat sink maximizes its heat dissipating efficiency by vertically mounting a pin array on the top of the device. This pin array keeps the PCB firmly in place and allows heat to more evenly disperse away from the point of contact. The mounting pins on the top of the device are made from copper which allows for excellent heat conductivity to the surrounding air. Additionally, the device has pre-applied thermal compound for connecting the heat sink to the PCB. This thermal compound enhances the thermal performance by directly connecting the PCB to the heat sink. The 575803B00000G heat sink is designed to be used for cooling in high-power components, such as those with integrated circuits and CPUs that generate significant amounts of heat. Due to its single piece construction, efficient heat transfer and thermal resistance, this device can provide reliable and effective cooling for devices in a wide range of applications. Overall, the 575803B00000G heat sink is designed for use in cooling printed circuit board applications that both require higher thermal performance and limited area for a PCB mounting component. This particular device has been constructed of high-performance aluminum, copper mounting pins and pre-applied thermal compound to provide excellent thermal performance and heat dissipating efficiency. It can provide reliable and effective cooling for devices in a wide range of applications and offers a thermal resistance of 167°K/W.

The specific data is subject to PDF, and the above content is for reference

Part Number	Manufacturer	Price	Quantity	Description