| Allicdata Part #: | 576403B00000G-ND |
| Manufacturer Part#: |
576403B00000G |
| Price: | $ 1.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
| Short Description: | BOARD LEVEL HEAT SINK |
| More Detail: | Heat Sink TO-3 Aluminum 10.0W @ 50°C Board Level |
| DataSheet: |  576403B00000G Datasheet/PDF |
| Quantity: | 1000 |
| 2500 +: | $ 1.40950 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | TO-3 |
| Attachment Method: | Bolt On |
| Shape: | Square, Pin Fins |
| Length: | 1.810" (45.97mm) |
| Width: | 1.810" (45.97mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.250" (31.75mm) |
| Power Dissipation @ Temperature Rise: | 10.0W @ 50°C |
| Thermal Resistance @ Forced Air Flow: | 1.50°C/W @ 600 LFM |
| Thermal Resistance @ Natural: | 5.10°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal or heat sink technology has been a hot topic in recent years due to its many advantages. They are used in a variety of applications, from cooling computer chips to protecting sensitive electronics from heat damage. The 576403B00000G is a type of heat sink that has been widely used in the electronics industry.
The 576403B00000G is a heat sink that uses aluminum as its base material and consists of a finned plate and a heat transfer plate. The finned plate creates an increased area for air to flow through, providing better cooling when compared to traditional flat plates. The heat transfer plate is a thin layer of material that acts as a thermal bridge between the heat sink and the component, transferring heat away from the component and into the air.
The 576403B00000G has many advantages over other heat sinks. Its ability to dissipate heat away from sensitive components makes it a valuable tool for those in the electronics industry. Furthermore, the anodized aluminum makes the 576403B00000G durable and resistant to corrosion and oxidation, which increases its lifespan. Additionally, the 576403B00000G is designed to be cost-effective, allowing manufacturers to save money while still getting the benefits of a quality heat sink.
The working principle of a 576403B00000G involves the transfer of heat away from the component and to the air. When the heat is generated by electrical components, the heat will travel along the heat transfer plate. This plate is designed to absorb the heat and transfer it away from the component. The heat is then dissipated into a heat sink’s finned plate, which increases the surface area of air, allowing for a more efficient cooling process.
The 576403B00000G has become an important tool in various fields of electronics and thermal management. It offers cost-efficiency, durability, and longevity, making it an ideal choice for those looking for a reliable heat sink solution. In addition, the 576403B00000G’s ability to dissipate heat from sensitive components without causing excessive stress makes it perfect for a variety of applications.
The specific data is subject to PDF, and the above content is for reference
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