576602B00000G

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Bolt On and PC Pin
Shape:	Rectangular, Fins
Length:	0.950" (24.13mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	1.0W @ 20°C
Thermal Resistance @ Forced Air Flow:	9.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	16.60°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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The 576602B00000G Thermal - Heat Sink is one of the leading thermal management solutions available on the market. It is designed to provide superior thermal performance and a wide range of application possibilities. This thermal management solution has been used in various applications, such as computer cooling, power-electronic devices, and laser diodes. The purpose of this article is to explore the application field and working principle of the 576602B00000G thermal - heat sink.The 576602B00000G thermal - heat sink is a passive thermal management solution that uses a combination of thermoelectric cooling, convection, and radiation to efficiently dissipate the heat generated by electronic components. The thermoelectric cooling element is composed of thermoelectric materials such as bismuth telluride (BI2TE3), which exhibit a large negative temperature coefficient, allowing for heat absorption from the component. The absorbed heat is then dissipated through the thermoelectric element either into the air or into another component.The 576602B00000G thermal - heat sink utilizes convection cooling to remove the heat from the device. The convection cooling process takes place when hot air near the device is replaced by cooler air that is circulated by a fan. The fan is typically controlled by the electronic device’s temperature, allowing the device to maintain its set temperature level. Additionally, the fan’s air currents cause the heated air to move away from the device, increasing the rate of convection cooling.Finally, the 576602B00000G thermal - heat sink utilizes radiation cooling to dissipate energy from the device. In radiation cooling, the absorbed energy from the device is emitted by infrared radiation from the surface of the thermal - heat sink. The radiation emitted is absorbed by cooler surfaces which are located farther away from the device.Overall, the 576602B00000G thermal - heat sink is an effective thermal management solution that can be used in a variety of applications. Its thermoelectric cooling element can efficiently absorb heat from the device and dissipate it either into the air or into other components. Additionally, its convection cooling and radiation cooling provide additional cooling capabilities, allowing for optimal performance of the device. With its wide range of application possibilities, the 576602B00000G thermal - heat sink is a great solution for thermal management.

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