576802B00000G

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Thermal - Heat Sinks encompass a range of technology used to dissipate heat generated by electronic components. The 576802B00000G Heat Sink is a robust heat sink suitable for high-power applications with demanding thermal requirements.

The 576802B00000G Heat Sink is composed of a specially designed aluminum base containing two copper heat pipes. Press fit fins provide increased surface area for cooling and are constructed from aluminum to ensure heat is efficiently dissipated away from the component. Different fin densities are available to ensure the best cooling results.

The integral design features of the 576802B00000G Heat Sink include two heat pipes and a press-fit finned aluminium upper section to ensure optimum thermal transfer from the heat source across the entire unit. The heat pipes draw heat away from the source, ultimately discharging it through the fins in contact with the air. Through the air\'s convection, the fins are cooled and the heat is dissipated from the unit.

The 576802B00000G Heat Sink is the ideal choice for applications that require general purpose thermal management such as telecommunication, automotive, power management, or even military shipboard electronics. Its uses include but are not limited to commercial servers, telecom projectors, industrial computers, battery chargers, motor speed controllers, fan heat sinks, and other cooling applications. With the rugged construction, superior heat removal capabilities and the ability to maintain precise temperature control in extended thermal cycling conditions make it the right choice for any application.

The 576802B00000G Heat Sink takes features a unique design in order to enhance the effectiveness of heat dissipation. Its aluminum housing has been specially designed to absorb and redirect heat away from the source and provide better cooling for the component. With two separate heat pipes, the heat can be moved quickly and directed away from the sources of higher levels of heat, taking the heat to other fin areas where additional heat can be dissipated. The press-fit fins give the 576802B00000G even greater ability to disburse the heat.

The 576802B00000G Heat Sink is also designed to maintain precise temperature control in a variety of harsh conditions. Its rugged construction ensures heat removal capabilities that will remain consistent while allowing for the precise control of temperature during thermal cycling conditions. The heat sink can be integrated with other components or stand-alone depending on the application.

In summary, the 576802B00000G Heat Sink is a robust thermal management solution that utilizes two copper heat pipes to move heat away from the source and dissipate it via an aluminum-constructed press-fit fin. It is ideal for a variety of electronic applications, including telecom, automotive, and military applications. The rugged construction, superior heat removal capabilities, and consistent control of temperature during thermal cycling conditions make it the right choice for a wide range of electronic applications.

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