577002B04000G Allicdata Electronics
Allicdata Part #:

HS367-ND

Manufacturer Part#:

577002B04000G

Price: $ 0.43
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK TO-220 W/TAB .25
More Detail: Heat Sink TO-220 Aluminum 1.5W @ 50°C Board Level,...
DataSheet: 577002B04000G datasheet577002B04000G Datasheet/PDF
Quantity: 18552
1 +: $ 0.39060
10 +: $ 0.37170
25 +: $ 0.35305
50 +: $ 0.34385
100 +: $ 0.33919
250 +: $ 0.31596
500 +: $ 0.29736
1000 +: $ 0.26948
5000 +: $ 0.26019
Stock 18552Can Ship Immediately
$ 0.43
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
Width: 0.520" (13.21mm)
Diameter: --
Height Off Base (Height of Fin): 0.250" (6.35mm)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 32.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a key element of the overall performance and reliability of electronic systems. 577002B0400G is a heat sink designed to meet the thermal management needs of various electronic devices, including computers. The 577002B0400G is a heat sink made of aluminum alloy and features a black-anodized finish. It has a two-piece construction consisting of a fan-like panel and two integral finned sides. The fan-like panel increases the airflow to the heat sink and helps to dissipate heat more quickly.

The 577002B0400G\'s application field primarily involves cooling devices or equipment that generate a significant amount of heat, such as processors, power components, and actuators. The heat sink is also used to reduce the level of heat generated by devices that consume large amounts of energy. Additionally, it is used to reduce the temperature of electronic components, thus preventing them from overheating and becoming damaged.

The 577002B0400G\'s working principle is based on the laws of thermodynamics and ideal gas laws. The heat sink works by transferring heat from the element it is attached to via conduction. Heat is transferred to a large area of fins as it passes through the fins. The fins dissipate this heat outward, dispersing it into the environment. Additionally, the fins are designed to optimize the airflow around them, helping the heat sink to dissipate heat more quickly. This helps the device to function more efficiently and prevents damage to the element.

In summary, the 577002B0400G is a thermal management solution designed to dissipate heat from various electronic devices. It is made up of two parts, a fan-like panel and two integral finned sides. Its working principle is based on thermodynamic laws and ideal gas laws. By transferring and dissipating heat away from the element, the 577002B0400G helps devices to function more efficiently and prevent damage to the element.

The specific data is subject to PDF, and the above content is for reference

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