
Allicdata Part #: | HS368-ND |
Manufacturer Part#: |
577102B04000G |
Price: | $ 0.44 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | HEATSINK TO-220 W/TAB .375" |
More Detail: | Heat Sink TO-220 Aluminum 1.0W @ 30°C Board Level,... |
DataSheet: | ![]() |
Quantity: | 11305 |
1 +: | $ 0.40320 |
10 +: | $ 0.38430 |
25 +: | $ 0.36515 |
50 +: | $ 0.35545 |
100 +: | $ 0.35066 |
250 +: | $ 0.32667 |
500 +: | $ 0.30744 |
1000 +: | $ 0.27862 |
5000 +: | $ 0.26901 |
Specifications
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 0.750" (19.05mm) |
Width: | 0.520" (13.21mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.375" (9.52mm) |
Power Dissipation @ Temperature Rise: | 1.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | 25.90°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sink generally refers to the thermal element, which can dissipate the excessive heat generated by other electronic components or devices in a device. When the power of electronic components increases and the working environment temperature is high, the heat generated is difficult to dissipate through the casing, so a heat sink should be used for heat dissipation. Among all types of heat sink, 577102B04000G is the most widely used.Application Field
577102B04000G\'s application field is mainly embedded in laptops, tablets, and other modern devices like digital cameras, smart watches etc. It\'s also widely applied in industrial equipments such as chemical industry, hydraulic equipment, and military industrial products. 577102B04000G can also be used in all types of automotive models where its lightweight and thermal performance provides unsurpassed cooling capability. Specifically, 577102B07000G is suitable for RISC & embedded processor cores, as well as digital signal processing (DSP) and high performance microprocessors.Working Principle
In general, all types of heat sinks work on the same basic principle. Heat is generated when electric components or devices are working and must be eliminated. The objectives of a heat sink are to remove heat from the components or devices, and transfer it away from the source. 577102B04000G adopts a traditional aluminum radiator fin heat sink design. It mainly takes advantage of natural or forced convection by providing a high surface area for air circulation. The design of 577102B04000G is based on its large air circulation surface area, which increases the cooling efficiency. It also uses advanced heatpipe technology to ensure the strongest possible heat transfer.Main Feature
577102B04000G\'s main feature is its large heat-transfer radiation area with extended surface fin designed to maximize heat transfer area. It also has an aluminum foil bonding to the cooling fins, which further enhances the heat transfer efficiency. Furthermore, its high quality fan and motor ensure a long service life and low noise operation. With the optimized design of the air duct, the air can quickly dissipate heat through the airflow generated by the fan. In addition, its lightweight aluminum housing allows the device to easily attach to any position.Conclusion
577102B04000G is a versatile and efficient heat sink that can be used for a wide variety of applications. It has large radiating area, low profile and high quality fan, as well as alloy cooling fins. This makes it ideal for applications requiring maximum cooling performance. Moreover, its light weight and low noise operation make it the perfect choice for any cooling related application.The specific data is subject to PDF, and the above content is for reference
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