577202B04000G

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Bolt On and PC Pin
Shape:	Rectangular, Fins
Length:	0.750" (19.05mm)
Width:	0.520" (13.21mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	1.5W @ 40°C
Thermal Resistance @ Forced Air Flow:	10.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	24.40°C/W
Material:	Aluminum
Material Finish:	Black Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: 577202B04000G Application Field and Working Principle

Heat sinks are invaluable components in many different electronics and industrial applications. They are designed to dissipate heat from components or machines in order to keep them operating at optimal levels. The thermal-heat sink 577202B04000G is a highly effective and relatively lightweight model, which is increasingly becoming the preferred choice for many operations. In this article, we\'ll explore the application field and working principles of the 577202B04000G.

Application Field of the 577202B04000G

The 577202B04000G heat sink is primarily used in data center and industrial applications, where component temperature management is critical. Its lightweight design and robust aluminum construction enable efficient and reliable dispersal of heat from the component or machine to keep it running at peak performance.In addition, the 577202B04000G also offers an impressive thermal resistance of 0.36m2K/W, making it one of the best heat sinks available for applications that require excellent thermal management. This thermal resistance makes it suitable for use in a variety of systems, from medical to telecommunications and data centers.

Working Principle of the 577202B04000G

The heat sink 577202B04000G utilizes a highly effective cross-flow principle that enables efficient dispersal of heat from components or machines. The principle is based on the interaction between two surfaces. One surface is responsible for absorbing heat, while the other is designed to dissipate it.First, the heat-generating component or machine is placed in direct contact with the absorption surface, which starts to absorb heat, transferring it to the dissipating surface. The dissipating surface, which inherently has a higher temperature than the absorption surface, then transmits the heat to the surrounding environment through convection and radiation processes. The cross-flow principle is highly efficient, thanks to the large contact area between the two surfaces, which ensures quick and effective heat dispersal.

Conclusion

As one of the best heat sinks available, the 577202B04000G offers reliable and efficient thermal management for many applications, from medical to telecommunications and data centers. The lightweight and robust aluminum construction, as well as the highly effective cross-flow principle, make it a great choice for operations that require outstanding thermal management.

The specific data is subject to PDF, and the above content is for reference

Part Number	Manufacturer	Price	Quantity	Description