Allicdata Part #: | 579604B00000G-ND |
Manufacturer Part#: |
579604B00000G |
Price: | $ 0.47 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-202 Aluminum 1.5W @ 40°C Board Level |
DataSheet: | 579604B00000G Datasheet/PDF |
Quantity: | 1000 |
10000 +: | $ 0.42492 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-202 |
Attachment Method: | Clip |
Shape: | Rectangular, Fins |
Length: | 0.900" (22.86mm) |
Width: | 0.745" (18.92mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.420" (10.67mm) |
Power Dissipation @ Temperature Rise: | 1.5W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 700 LFM |
Thermal Resistance @ Natural: | 24.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are one of the most important components of any electronics or machinery. Every component within a system needs to be kept at a certain temperature in order to operate properly. There are various types of systems that use thermal energy dissipation - these systems are referred to as ‘heat sinks’.
579604B00000G is an example of a thermal - heat sink. This particular sink is designed to dissipate heat away from the device or component that it is connected to. It is made up of a metal housing that provides a thermal barrier, and a fan that dissipates the heat away from the device. The housing is made of a high-grade aluminum alloy that provides excellent thermal conductivity and heat dissipation. The fan is specially designed to be quiet and efficient.
The 579604B00000G can be used in almost any application where thermal energy management is required. It can be used in CPUs, GPUs, and other components that require a certain operating temperature. This model is also designed to be compact and lightweight, making it easy to install and transport, as well as easy to maintain.
The 579604B00000G operates by taking the heat generated by a component or device and dissipating it away from the device itself. This is done through the components of the housing and the fan. The housing is designed to dissipate the heat away from the device by providing a barrier between the device and the fan. The fan then pushes the heat away from the device, cooling it in the process. This process allows devices to operate at the desired temperature without overheating or burning out.
Due to the 579604B00000G’s efficiency and effectiveness, it is the ideal thermal – heat sink for any application that requires thermal energy management. Its lightweight design also makes it perfect for applications where size and portability are an issue, such as server racks or computers on the go. The ease of use and installation make it a great choice for those who do not want to spend time or money installing a more complex heat sink system.
In conclusion, the 579604B00000G is a reliable, efficient, and cost-effective thermal – heat sink. It is a great choice for any application that requires thermal management and is designed for easy installation and maintenance. With its ability to effectively manage and dissipate heat away from a device, it is the perfect choice for any application that needs to stay cool and running at its best.
The specific data is subject to PDF, and the above content is for reference
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