579704B00000G Allicdata Electronics
Allicdata Part #:

579704B00000G-ND

Manufacturer Part#:

579704B00000G

Price: $ 0.89
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-202 Aluminum 1.5W @ 40°C Board Level,...
DataSheet: 579704B00000G datasheet579704B00000G Datasheet/PDF
Quantity: 1000
6000 +: $ 0.80032
Stock 1000Can Ship Immediately
$ 0.89
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-202
Attachment Method: Clip
Shape: Rectangular, Fins
Length: 0.900" (22.86mm)
Width: 0.745" (18.92mm)
Diameter: --
Height Off Base (Height of Fin): 0.420" (10.67mm)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 24.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are an important component in the operation of many electronic and mechanical devices, as they dissipate heat from components such as transistors, resistors, microprocessors, and other components. A 579704B00000G heat sink is a type of heat sink designed for high power densities and applications where surface area is an important factor. This article will explain the application field and working principle of this particular type of heat sink.

The 579704B00000G heat sink is designed for applications with high power densities. The heat sink is composed of a large number of fins arranged in a number of layers to increase the surface area of the heat sink. These fins are interconnected and form a type of radiator, which dissipates heat quickly from components running at high power densities. The number of fins and the layer arrangement helps to maximize the surface area of the heat sink, which is important in devices where heat dissipation is a major concern.

The 579704B00000G heat sink is designed to be used in electronic and mechanical devices that require high power efficiency. It is used to dissipate heat from over-clocking processors, video cards, power supplies, and more. The fanless design of the heat sink ensures that quiet operation is maintained, as well as energy efficiency.

The working principle of the 579704B00000G heat sink is simple. The heat from the component is transferred to the fins via conduction. The fins then dissipate the heat to the surrounding environment. This heat transfer is accomplished quickly and efficiently, allowing components to operate at their maximum capacity.

In conclusion, the 579704B00000G heat sink is an important component in many electronic and mechanical devices. It is designed for high power densities, and its fanless design ensures energy efficiency and quiet operation. The working principle is based on the transfer of heat from the component to the fins, and then dissipating heat to the surrounding environment. The design of the heat sink maximizes the surface area, which is important in applications where heat dissipation is a major concern.

The specific data is subject to PDF, and the above content is for reference

Related Products
Search Part number : "5797" Included word is 2
Part Number Manufacturer Price Quantity Description
57974-050 Amphenol FCI 0.0 $ 1000 CONN PCMCIA CARD PUSH-PUS...
579704B00000G Aavid, Therm... 0.89 $ 1000 BOARD LEVEL HEAT SINKHeat...
Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics