Allicdata Part #: | 579704B00000G-ND |
Manufacturer Part#: |
579704B00000G |
Price: | $ 0.89 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-202 Aluminum 1.5W @ 40°C Board Level,... |
DataSheet: | 579704B00000G Datasheet/PDF |
Quantity: | 1000 |
6000 +: | $ 0.80032 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-202 |
Attachment Method: | Clip |
Shape: | Rectangular, Fins |
Length: | 0.900" (22.86mm) |
Width: | 0.745" (18.92mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.420" (10.67mm) |
Power Dissipation @ Temperature Rise: | 1.5W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 11.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | 24.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks
Heat sinks are an important component in the operation of many electronic and mechanical devices, as they dissipate heat from components such as transistors, resistors, microprocessors, and other components. A 579704B00000G heat sink is a type of heat sink designed for high power densities and applications where surface area is an important factor. This article will explain the application field and working principle of this particular type of heat sink.
The 579704B00000G heat sink is designed for applications with high power densities. The heat sink is composed of a large number of fins arranged in a number of layers to increase the surface area of the heat sink. These fins are interconnected and form a type of radiator, which dissipates heat quickly from components running at high power densities. The number of fins and the layer arrangement helps to maximize the surface area of the heat sink, which is important in devices where heat dissipation is a major concern.
The 579704B00000G heat sink is designed to be used in electronic and mechanical devices that require high power efficiency. It is used to dissipate heat from over-clocking processors, video cards, power supplies, and more. The fanless design of the heat sink ensures that quiet operation is maintained, as well as energy efficiency.
The working principle of the 579704B00000G heat sink is simple. The heat from the component is transferred to the fins via conduction. The fins then dissipate the heat to the surrounding environment. This heat transfer is accomplished quickly and efficiently, allowing components to operate at their maximum capacity.
In conclusion, the 579704B00000G heat sink is an important component in many electronic and mechanical devices. It is designed for high power densities, and its fanless design ensures energy efficiency and quiet operation. The working principle is based on the transfer of heat from the component to the fins, and then dissipating heat to the surrounding environment. The design of the heat sink maximizes the surface area, which is important in applications where heat dissipation is a major concern.
The specific data is subject to PDF, and the above content is for reference
Part Number | Manufacturer | Price | Quantity | Description |
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57974-050 | Amphenol FCI | 0.0 $ | 1000 | CONN PCMCIA CARD PUSH-PUS... |
579704B00000G | Aavid, Therm... | 0.89 $ | 1000 | BOARD LEVEL HEAT SINKHeat... |