Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Bolt On
Shape:	Rectangular, Fins
Length:	1.500" (38.10mm)
Width:	0.640" (16.26mm)
Diameter:	--
Height Off Base (Height of Fin):	0.640" (16.26mm)
Power Dissipation @ Temperature Rise:	3.0W @ 50°C
Thermal Resistance @ Forced Air Flow:	3.00°C/W @ 500 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

581102B00000 Application Field and Working Principle

The 581102B00000 thermal field and working principle can be used to describe a type of thermal component, specifically a heat sink. Heat sinks are designed to manage and redirect the energy created by heat, produced either naturally or by electrical components, away from the source and through a dissipative interface. This form of thermal management is essential for the functioning of advanced components used in consumer electronics and industrial equipment.Heat sinks are made up of a series of channels or connectors that run between the source and the dissipative interface which helps to disperse the heat. The 581102B00000 thermal field and working principle, is a type of heat sink that features thicker channels to improve the overall thermal efficiency. The design of the 581102B00000 is made with copper components as copper is an excellent conductor of heat. Its cylindrical form allows it to be easily inserted into electronic devices. The heat dissipation process of the 581102B00000 is highly efficient due to several design features. The inner channels are lined with a highly efficient and efficient ceramic material. This material helps to quickly and evenly disperse heat away from the source, ensuring that the temperature is spread evenly and quickly. The outer surface of the heat sink is also designed to provide a large surface area, which captures and absorbs heat energy. The 581102B00000 is also designed with an automatic shut-off system which prevents potential damage from heat overload. This system works by cutting off all power to the heat load if the temperature reaches a certain level. This feature is particularly important for industrial and consumer electronic applications where the safety of personnel and devices must be ensured. Overall, the 581102B00000 thermal field and working principle provides a reliable and safer way to manage the thermal load of components in electronic devices. Its thick channels and automatic shut-off system provide superior thermal management compared to traditional methods, making it an excellent choice for a variety of electronic components.

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