590102B03600G Allicdata Electronics
Allicdata Part #:

HS370-ND

Manufacturer Part#:

590102B03600G

Price: $ 0.94
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK TO-220 W/TABS 1.67"HIGH
More Detail: Heat Sink TO-220 Aluminum 2.5W @ 30°C Board Level,...
DataSheet: 590102B03600G datasheet590102B03600G Datasheet/PDF
Quantity: 5577
1 +: $ 0.85050
10 +: $ 0.80577
25 +: $ 0.78448
50 +: $ 0.76318
240 +: $ 0.72077
480 +: $ 0.67838
720 +: $ 0.63599
1200 +: $ 0.59359
5040 +: $ 0.57239
Stock 5577Can Ship Immediately
$ 0.94
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 1.675" (42.55mm)
Width: 1.000" (25.40mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: 2.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 10.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.
Thermal - Heat Sinks

The thermal management of a range of electronic components can often be difficult due to their small size and high power requirements. It is important that these components are kept cool to ensure they operate correctly and reliably. Heat sinks, which dissipate heat generated by power components, can be used in this situation. The 590102B03600G Heat Sink is a commonly used item used in this application.

Application Field

The 590102B03600G heat sink is designed for a variety of thermal management applications. It can be used in a range of electronic and electrical components, such as microprocessors, power modules, and voltage regulators. With its large surface area, it can dissipate large amounts of heat across a large area. Due to its small size, it can also be used in confined spaces, such as on laptop computers or in other areas where space is limited.

Working Principle

The working principle of the 590102B03600G heat sink is based on the basic principles of thermal dynamics. Heat sinks work by transferring the heat generated by a power component to the surrounding air. This is achieved by using the cooling fins on the heat sink to increase the surface area, which allows more air to come in contact with the heat sink. The air then absorbs the heat and carries it away from the component, keeping it cool.

Material

The 590102B03600G heat sink is made from an aluminium alloy. This material provides high thermal conductivity, which increases the speed at which the heat can be transferred away from the component. The aluminium also has a low coefficient of thermal expansion, which helps reduce any movement of the heat sink due to temperature changes.

Mounting

The 590102B03600G heat sink is designed for mounting using 4 mounting holes. It is important that these mounting screws protrude out of the component by at least 0.125in to ensure that the heat sink has an air gap to allow air to flow through and dissipate the heat. It is also important to ensure that the component is mounted flush to the heat sink as any uneven space could create an air pocket that would reduce the efficiency of the heat sink.

Conclusion

The 590102B03600G heat sink is an efficient and effective way to manage the heat generated by a range of electrical and electronic components. Its small size and high thermal conductivity make it ideal for use in confined spaces. It is important to ensure that the heat sink is installed correctly, with all screws screwed in correctly and flush with the component to ensure that it operates correctly and efficiently.

The specific data is subject to PDF, and the above content is for reference

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