Allicdata Part #: | 592502B02800G-ND |
Manufacturer Part#: |
592502B02800G |
Price: | $ 0.46 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-220 Aluminum 1.5W @ 40°C Board Level,... |
DataSheet: | 592502B02800G Datasheet/PDF |
Quantity: | 1000 |
10000 +: | $ 0.40868 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and Board Locks |
Shape: | Rectangular, Fins |
Length: | 1.250" (31.75mm) |
Width: | 0.875" (22.22mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.250" (6.35mm) |
Power Dissipation @ Temperature Rise: | 1.5W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 10.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 22.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks has become an indispensable part of modern technology. The 592502B02800G heat sink is a piece of equipment used to conduct heat away from a hot component, dissipating the heat into the surrounding environment. The use of the 592502B02800G heat sink is essential for electronic devices to continue running at optimal performance.
As technology advances and electronic components become smaller and more efficient, heat sinks are necessary to dissipate the increased heat that is produced in a smaller space. Without the 592502B02800G heat sink, these components would quickly overheat, leading to failure. This makes them an essential component to ensure the longevity of any device.
The function of the 592502B02800G heat sink is essential for electronic devices to be able to operate correctly and efficiently. It is designed to dissipate heat from the device through its large surface area. As heat is moved away from the device, it is then dissipated into the surrounding environment through the heat sink\'s fins. The larger the surface area of the heat sink, the more effective it is at dissipating heat.
The 592502B02800G heat sink is made out of aluminum and features a large fin design that helps to increase the surface area for better heat dissipation. It also contains a number of small holes and channels, which are designed to help improve the airflow around the components and increase cooling efficiency. The heat sink also features a copper base, which helps to draw heat away from the components and disperse it faster.
The 592502B02800G heat sink is designed for applications that require maximum cooling performance. It is suitable for a wide range of devices, including computers, servers, and consumer electronics. It can be used in a variety of environments, from industrial settings to home offices. The heat sink is designed to be easy to install and the highly efficient design ensures that the device runs optimally at all times.
In order to ensure optimal cooling performance, the 592502B02800G heat sink should be used in conjunction with a fan. This helps to ensure that the device maintains optimal performance by providing an additional layer of cool air. The fan helps to create an airflow around the heat sink, allowing the heat to be more effectively dissipated into the surrounding environment.
Overall, the 592502B02800G heat sink is an essential component for any electronic device that is in need of efficient and reliable cooling. The large surface area and efficient design ensure that heat is quickly and efficiently dissipated into the surrounding environment. The addition of a fan also aids in the dissipation process, allowing the device to maintain optimal performance and longevity.
The specific data is subject to PDF, and the above content is for reference
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