Allicdata Part #: | 601K-ND |
Manufacturer Part#: |
601K |
Price: | $ 2.26 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK FOR TO66 |
More Detail: | Heat Sink |
DataSheet: | 601K Datasheet/PDF |
Quantity: | 1000 |
270 +: | $ 2.03298 |
Series: | * |
Part Status: | Active |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
。Heatsinks are essential components of both commercial and consumer electronic devices. They are used to cool devices by dissipating heat generated by components such as CPUs, GPUs, power transistors, and voltage regulators. When a chip heats up, the heat must be dissipated to protect the circuits from overheating. Heat sinks accomplish this by conducting the heat away from the chip and transferring it to the air or a liquid. The heat sink\'s design must be tailored to the device in order to achieve optimal cooling performance. The most common type of heat sink used today is a 601K (copper finned heat sink) due to its superior thermal performance.
The 601K is the most widely used heat sink because of its superior thermal properties compared to other types of heat sinks. The 601K is composed of high-grade aluminum alloy with copper fins welded to the body. This combination provides excellent heat capacity and excellent thermal conductivity. The copper fins provide a greater surface area for dissipating heat compared to aluminum heat sinks, making the 601K more efficient at dissipating heat. The fins also provide for additional turbulence of the air surrounding the heat sink, allowing for the most efficient air-cooling of the device.
The working principle of a 601K heat sink is simple. When a device gets hot, the heat is transferred from the device to the heat sink, and then to the environment through convection and conduction. Convection is the process by which air molecules move around the fins of the heat sink and dissipate the heat as it is transferred to the air, while conduction is the direct transfer of heat from the heat sink to the air molecules. The more contact the heat sink has with the air, the more efficient it will be at dissipating heat.
The 601K is one of the most ubiquitous heat sinks on the market today due to its superior thermal performance. It is used in many consumer and commercial applications, including laptops, PCs, servers, medical devices, and consumer electronics. The 601K has been used in a variety of different application areas due to its high thermal performance and its cost effectiveness. The 601K is easily customizable for any application due to its ability to be bent, drilled, and machined into any desired shape. It is also an ideal choice for applications where low noise and low power consumption are required.
The 601K heat sink is a versatile and reliable choice for those looking for an effective way to cool their electronic devices. Its superior thermal performance and cost effectiveness make it the ideal choice for a wide range of applications, including consumer electronics, medical equipment, PCs, servers, and more. With its ability to be bent, drilled, and machined into any desired shape, the 601K heat sink is able to provide superior cooling performance in the most demanding applications.
The specific data is subject to PDF, and the above content is for reference
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