603K Allicdata Electronics
Allicdata Part #:

603K-ND

Manufacturer Part#:

603K

Price: $ 4.23
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK FOR TO66
More Detail: Heat Sink
DataSheet: 603K datasheet603K Datasheet/PDF
Quantity: 135
1 +: $ 3.80520
Stock 135Can Ship Immediately
$ 4.23
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are thermal management devices designed to regulate temperature. They work by transferring heat away from hot components, such as computer processors, and dissipating it into the air. Heat sinks are commonly made of aluminum or copper and feature various heat-dissipating fins, ridges, or protrusions. They can be attached to a component directly or via a thermal conductive pad.

603K is an industrial-grade hexagonal aluminum heat-sink for two-stage cooling. It comes with a manganese-based brass base, which increases the thermal resistance, reducing the need for a fan.
The 603K features a hollow hexagonal structure with a heat-pipe in the center. The heat-pipe dissipates heat to the surrounding aluminum fins. The fins are arranged in an alternating vertical and horizontal pattern, and the whole assembly is covered with a shell. The shell and heat-pipe aid in dissipating heat quicker and more efficiently than traditional heat sink designs.

The 603K heat sink is designed to work with a variety of components. It features a base plate with four mounting holes for attaching the heat-sink to your desired component. The base also features four K-type screw threads, which allow you to attach an optional fan or cooling system directly to the heat sink. It is also compatible with a variety of different fan sizes.

The 603K heat-sink is capable of cooling components with a maximum temperature of up to 150°C. It works best when used with high-powered components such as CPUs or GPUs. Its large heat-dissipating area is also suitable for more sensitive components such as FPGAs.

The 603K heat-sink is an ideal choice for cooling components in industrial applications. It is robust and reliable, and its unique hexagonal structure ensures maximum thermal efficiency and cooling performance. Compared to traditional single-stage cooling, the 603K’s two-stage cooling process reduces stress on the components, increasing their lifespan.

The 603K’s efficient design also helps in reducing noise levels, making it ideal for noise-sensitive applications. Furthermore, its manganese-based brass base provides superior thermal conductivity, making it a great choice for high-powered applications.

In conclusion, the 603K is a reliable and effective heat-sink for industrial applications. Its hexagonal structure and two-stage cooling process provide maximum cooling performance, while its manganese-based brass base ensures thermal efficiency. The 603K is also compatible with a variety of fan sizes and is capable of cooling components up to 150°C.

The specific data is subject to PDF, and the above content is for reference

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