6225B-MTG

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Bolt On and PC Pin
Shape:	Rectangular, Fins
Length:	1.070" (27.18mm)
Width:	1.024" (26.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.315" (8.00mm)
Power Dissipation @ Temperature Rise:	2.0W @ 40°C
Thermal Resistance @ Forced Air Flow:	3.00°C/W @ 700 LFM
Thermal Resistance @ Natural:	15.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction

The 6225B-MTG is a thermal-heat sink device used in a wide variety of applications such as industrial and telecommunications. The device is not only designed to dissipate heat that is generated by electronic components, but it also reduces noise and improves system cooling, helping to protect sensitive equipment. This article will explain the application field and working principle of the 6225B-MTG.

Application Field

The 6225B-MTG is a type of thermal-heat sink device that is most commonly used in applications such as industrial and telecom. This device is used to dissipate heat from components such as semiconductor chips, resistors, capacitors, and other components, helping to maintain a safe and stable operating temperature for long-term operation. Additionally, it can also be used to dissipate heat from medium- and high-power LED applications.This device is also commonly used in air-conditioning systems to improve system efficiency and cooling. It helps to provide a cooling effect by removing heat from the air-conditioner, helping to reduce operating costs. Additionally, this device can also be used in server rooms to keep computers and other IT equipment cool.

Working Principle

The working principle of the 6225B-MTG is quite simple and straightforward. This thermal device utilizes a heat-sink structure, which allows for efficient dissipation of heat from components. This structure works by spreading the heat of a component over the surface area of the device. This spread heat is then conducted through the metal components of the device and dissipated into the surrounding atmosphere.Additionally, this device also uses cooling fans to supplement its functioning. The cooling presence of the cooling fan helps to provide additional heat removal, helping to reduce the overall temperature of the system. This combination of heat-sink structure and cooling fan helps to provide an efficient method of heat dissipation.

Conclusion

The 6225B-MTG is an effective thermal-heat sink device that is used in a wide variety of industrial and telecom applications. This device is designed to dissipate heat from components, helping to maintain a safe and stable operating temperature for long-term operation. Additionally, it helps to improve system cooling and reduce noise, helping to protect sensitive equipment. Finally, the working principle of the device is quite straightforward, with a heat-sink structure and cooling fan helping to provide efficient heat removal.

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