| Allicdata Part #: | 6239B-MTG-ND |
| Manufacturer Part#: |
6239B-MTG |
| Price: | $ 0.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
| Short Description: | BOARD LEVEL HEAT SINK |
| More Detail: | Heat Sink TO-220 Aluminum 2.0W @ 40°C Board Level,... |
| DataSheet: |  6239B-MTG Datasheet/PDF |
| Quantity: | 1000 |
| 5000 +: | $ 0.84795 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Clip and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.159" (29.44mm) |
| Width: | 1.005" (25.53mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.610" (15.49mm) |
| Power Dissipation @ Temperature Rise: | 2.0W @ 40°C |
| Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 600 LFM |
| Thermal Resistance @ Natural: | 13.60°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks
6239B-MTG is a type of integrated thermal-heat sinks, which are commonly used to disperse generated heat away from a device and into the environment. The thermal-heat sink works by using a series of aluminum or copper blades to draw heat away from a device. The thermal-heat sink is connected to the device via thermal-pad and/or thermal gap pad.
The operation of 6239B-MTG heat sink is based on the principle of conduction. As the heat is generated, it is conducted through the heat sink via the actual assembly material. The heat is then released into the surrounding ambient air temperature, thus dissipating the stored energy and keeping the device cool.
The heat sinks manufactured by 6239B-MTG employ a number of design characteristics to optimize heat dissipation. Utilizing a combination of natural air flow and integral components to maximize cooling efficiency, the 6239B-MTG heat sink is designed to disperse heat in the most effective and efficient way. The composition of the heat sink includes an array of fans or pin fin designs, a number of blades, and a series of support structures secured to the device.
To maximize cooling efficiency, 6239B-MTG heat sinks offer an adjustable design, allowing for adjustment of the aluminum blades to accommodate a range of devices. The adjustable design also allows for easy installation and maintenance of the heat sink.
An effective thermal-heat sink is essential for any embedded solution requiring high performance and low power consumption from its heat-generating components. With the right design and installation, the 6239B-MTG heat sink is an effective means of dissipating heat away from a device. Used in combination with an appropriate fan assembly, the 6239B-MTG heat sink offers an integrated cooling solution for most embedded devices.
The specific data is subject to PDF, and the above content is for reference
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