6273B Allicdata Electronics
Allicdata Part #:

6273B-ND

Manufacturer Part#:

6273B

Price: $ 0.31
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-202 Aluminum 1.5W @ 40°C Board Level
DataSheet: 6273B datasheet6273B Datasheet/PDF
Quantity: 1000
15000 +: $ 0.27764
Stock 1000Can Ship Immediately
$ 0.31
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-202
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 0.750" (19.05mm)
Width: 0.750" (19.05mm)
Diameter: --
Height Off Base (Height of Fin): 0.375" (9.52mm)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 21.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are prominent components in modern engineering and thermal management systems. The 6273B application field and working principle demonstrates the importance of this technology in our everyday life. Through its purpose, design, and working mechanism, the 6273B shows how its heat sink technology can be combined with user applications to create sustainable thermal solutions.

The 6273B application field consists of a wide range of user applications. It is often used in automotive electronics, motor control, power supplies, computers, and other electronic equipment. Additionally, the 6273B has a wide range of applications in aerospace, medical, military, and many other fields. The size and configuration of the 6273B allow for it to be easily adapted to many applications both in metallic and plastic user applications.

The 6273B heat sink is made from extruded aluminum and utilizes a unique fin shape for maximum heat dissipation. This fin shape consists of an array of widely spaced fins and a deep grove profile that maximizes the surface area exposed to the air. This means that the 6273B is able to dissipate more heat than other traditional heat sinks.

The 6273B is a key element of thermal design because of its ability to couple heat transfer from the heat source to the ambient environment. The 6273B utilizes conduction and natural convection to transfer the heat away from the source. Due to the design of the fin, the 6273B effectively increases the surface area of the heat sink, and thus increases the rate of the heat transfer. This allows the 6273B to maintain thermal performance, even when operating at high temperatures and in enclosed spaces.

The 6273B is capable of dissipating a wide range of power levels, depending on the design parameters of the application. These various power ratings can range from a few watts up to a few hundred watts. The 6273B is well suited for applications that require larger power dissipation levels, such as high power processors and servers.

The 6273B also utilizes different technologies to facilitate efficient heat dissipation. These technologies include a diffusion film for heat spreading, air baffles for air redistribution, and a thermal management system for controlling the temperature. With this combination of technologies, the 6273B is able to provide users with sustained thermal performance over a long period of time.

The 6273B also provides a range of customization options to the user. Through its unique configuration, the 6273B can be tailored to meet the specific needs of an application. With its wide range of mounting options, the 6273B can be integrated into a variety of spaces. Additionally, the 6273B can be equipped with a range of accessories and features to optimize the thermal management system.

The 6273B is an integral part of the thermal management process and should be taken into account when designing any system. With its combination of thermal efficiency and customization, the 6273B can provide sustainable thermal solutions for any application. As a result, the 6273B demonstrates how effective thermal management can be achieved through the use of heat sink technology.

The specific data is subject to PDF, and the above content is for reference

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