6380BG

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220, TO-218
Attachment Method:	Bolt On and PC Pin
Shape:	Rectangular, Fins
Length:	1.000" (25.40mm)
Width:	1.650" (41.91mm)
Diameter:	--
Height Off Base (Height of Fin):	1.000" (25.40mm)
Power Dissipation @ Temperature Rise:	6.0W @ 50°C
Thermal Resistance @ Forced Air Flow:	3.50°C/W @ 200 LFM
Thermal Resistance @ Natural:	6.80°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

Thermal - Heat Sinks (THS) are devices designed to dissipate heat away from components and electronics. THSs transfer heat from the heated component to a wider area, providing cooling for the component and reducing the risk of thermal overload or failure. The most common THSs are constructed from copper or aluminium and are usually attached to the component using screws or adhesive.The 6380BG is a THS designed for applications where high heat dissipation is required. It is constructed from copper and is designed to fit into a 1U rack. It uses a passive heat-sink fin design that increases the surface area and providing increased cooling efficiency.The 6380BG consists of a large aluminum base plate with several heat-sink fins attached. The base plate is designed with four corner mounting screw holes and interacts with the case or other components using spring screws which hold the heat sink in place. The fins on the 6380BG are also relatively thin, thereby allowing better air flow and heat dissipation.The working principle of the 6380BG is based on the same principles of thermodynamics as other heat sinks. Heat is generated by the device or component being cooled and transferred away from the device through the heat-sink. The heat is then dissipated into the air by convection and radiation.The 6380BG is designed to efficiently transfer heat away from the CPU, memory chips and other components. It is ideal for space constrained applications, such as in 1U rack-mount servers, where high levels of heat dissipation are required. It is also suited for applications that may require large-scale cooling, such as gaming consoles and computer systems.The 6380BG is an effective THS for providing reliable heat dissipation and preventing thermal overloads. Its effective heat transfer properties make it ideal for applications that require high levels of heat dissipation in limited space. The 6380BG\'s passive, fin design is also much quieter than active cooling devices, giving it a substantial advantage in applications where noise levels may be an important consideration.

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