Allicdata Part #: | 6382BG-ND |
Manufacturer Part#: |
6382BG |
Price: | $ 1.95 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-218, TO-220, TO-247, Multiwatt (Dual)... |
DataSheet: | 6382BG Datasheet/PDF |
Quantity: | 1000 |
2500 +: | $ 1.75757 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-218, TO-220, TO-247, Multiwatt (Dual) |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 2.000" (50.80mm) |
Width: | 1.650" (41.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 20°C |
Thermal Resistance @ Forced Air Flow: | 3.50°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 4.20°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks: 6382BG Application Field and Working Principle
Heat sinks are devices used to transfer heat from one medium to another. Thermal conductivity is important in these devices due to the large amount of heat they must dissipate. Heat sinks generally help dissipate heat from a hot component that passes through the heat sink and is dispersed into the surrounding air or other medium. In this sense, the heat sink acts as a bridge between the component and the surrounding air. In electronics, this can be achieved with a fan, fan guard, or other means of thermal transfer.
The 6382BG is an extremely efficient and versatile heat sink that is designed to provide superior cooling performance in a variety of high-power applications. It features a unique design that allows for better airflow through the sink, while also providing excellent thermal conductivity. Its patent-pending design utilizes a combination of copper fins, which function as channels for circulating air, and a large heat-dissipating center section. This allows the heat sink to maximize its cooling performance while minimizing the amount of space needed to install it.
The 6382BG heat sink is primarily designed for use in high-power applications such as computers, servers, and other electronics containing high-powered components. Its design allows for efficient and effective heat transfer that minimizes any potential hot spots. Its thermal conductivity is higher than traditional aluminum or copper heat sinks, allowing the device to dissipate heat quickly and more evenly. The 6382BG is also well-suited for applications where space is limited due to its compact design.
The 6382BG heat sink\'s working principle can be described as follows: when the hot component is brought into contact with the heat sink, the thermal energy is transferred from the component to the heat sink. The thermal energy is then dissipated by the heat sink\'s fins and center section. As the thermal energy passes through the heat sink, it is dissipated into the surrounding air, thus cooling the component. The faster the air moves through the fins, the faster it can dissipate the heat, which is why the heat sink should be installed in a well-ventilated area.
The 6382BG heat sink is a great choice for high-power applications due to its efficiency and versatility. Its patent-pending design allows for superior heat transfer and rapid dissipation of heat. Its thermal conductivity is higher than traditional aluminum or copper heat sinks, allowing the device to dissipate heat quickly and more evenly. Its unique design ensures that it can fit into tight spaces, and its fan guard helps prevent dust and debris from entering and disrupting the heat transfer.
The 6382BG heat sink is an excellent choice for any application where it is important to quickly and effectively dissipate large amounts of heat. Its high-performance design ensures that it can handle even the most demanding applications, making it a great choice for those looking for maximum efficiency and reliability.
The specific data is subject to PDF, and the above content is for reference
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