6399B-P2G Allicdata Electronics
Allicdata Part #:

6399B-P2G-ND

Manufacturer Part#:

6399B-P2G

Price: $ 0.93
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-220 Aluminum 8.0W @ 40°C Board Level,...
DataSheet: 6399B-P2G datasheet6399B-P2G Datasheet/PDF
Quantity: 1000
3000 +: $ 0.83620
Stock 1000Can Ship Immediately
$ 0.93
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Width: 1.650" (41.91mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: 8.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 3.30°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The 6399B-P2G application field is a type of thermal interface material used to increase the overall heat dissipation rate of a device. It has a wide range of uses, including cooling electronic components and controlling temperatures in devices such as solar panels or even in engine compartments.

It utilizes the science of thermal conduction, which is the transfer of heat between two solid materials. Thermal conduction is used to create a thermal transfer path between two materials, forcing a heat exchange that is proportional to the size of the contact area between the two materials. In the case of the 6399B-P2G, these materials are usually a heat source such as an electronic component or a hot spot within an engine compartment, and a heat sink such as a metal cooling plate.

The 6399B-P2G application field is designed to increase the efficiency of this thermal transfer path in order to effectively dissipate the heat away from the component. It consists of a thin layer of material with a high thermal conductivity that is sandwiched between the two materials. This allows the heat to pass through the layer of material quickly, reducing the amount of time that it remains on or near the component, thus reducing the overall temperature of the component.

This type of thermal interface material is incredibly versatile, as it is capable of being used in a wide variety of applications. It can be used to cool sensitive electronic components, to regulate temperatures of engine compartments, and even to provide cooling to solar panels. In addition, it is able to do this without the need for additional fans or pumps, as it utilizes the thermal transfer path to dissipate heat from the component.

In addition to its versatility, the 6399B-P2G application field is highly reliable. Its thin layer is designed to withstand temperatures up to 500 degrees Celsius and it can be used in a variety of environments. This makes it perfect for use in high-temperature applications, as it is able to remain durable even when exposed to extremely high temperatures.

Overall, the 6399B-P2G application field is an incredibly reliable and versatile way to increase the efficiency of thermal transfer paths. It is highly effective at dissipating heat away from components, as well as providing superior temperature control. In addition, it has a wide range of applications ranging from cooling sensitive electronic components to controlling temperatures of engine compartments and solar panels. Finally, it is highly reliable and able to withstand temperatures up to 500 degrees Celsius, making it the perfect material for use in high-temperature applications.

The specific data is subject to PDF, and the above content is for reference

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