66100-501 Allicdata Electronics
Allicdata Part #:

926-1039-ND

Manufacturer Part#:

66100-501

Price: $ 43.96
Product Category:

Fans, Thermal Management

Manufacturer: Laird Technologies - Engineered Thermal Solutions
Short Description: PELTIER MOD CP2,127,06,L1,W4.5
More Detail: Peltier Module 62.00mm x 62.00mm x 4.57mm 122.3W @...
DataSheet: 66100-501 datasheet66100-501 Datasheet/PDF
Quantity: 123
1 +: $ 39.96720
10 +: $ 36.46190
25 +: $ 35.29340
Stock 123Can Ship Immediately
$ 43.96
Specifications
Series: CP
Part Status: Active
Outline L x W x H: 62.00mm x 62.00mm x 4.57mm
Qmax @ Th: 122.3W @ 25°C
Delta Tmax @ Th: 67°C @ 25°C
Current - Max: 14.3A
Voltage - Max: 14.5V
Resistance: 940 mOhms
Operating Temperature: 80°C
Features: Lead Wires, Non-Sealed
Description

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Thermoelectric, Peltier Modules, allow heat to be transferred from one side of the module to another. The module contains two materials which tend to heat up when current is applied, and one heats up as the other cools. The 66100-501 module can be used as an efficient means of cooling.

The 66100-501 is designed using thermoelectric technology which is based on the special thermal-electric behavior of semiconductors. The module incorporates two dissimilar semiconductor elements, referred to as p-type and n-type semiconductors. Electron flow is enabled through the p-type side, and holes are allowed to flow through the n-type side.

The module works by passing current through the two sides of the module. When current is applied, the two sides become hotter or colder, depending on the direction of the current. The module creates a thermoelectric effect, allowing not only heat to be transferred from one side to another, but also electricity to be generated from heat, or vice versa. The 66100-501 is designed to enable efficient cooling, as the p-type side will be hotter and the n-type side cooler.

The 66100-501 module is made up of two hot-side elements and two cold-side elements, with a top-side heat sink. On the hot-side elements there is a thermoelectric material embedded into a metal case with a heat sink attached. Heat from the hot-side elements is transferred to the heat sink in the module top, and then the heat from the hot-side elements is dissipated to the environment. On the cold-side elements there is a thermoelectric material also embedded into a metal case with a heat sink attached. However, here the heat from the cold-side elements is transferred to the heat sink in the module top, and from there dissipates to the cold environment.

The 66100-501 is capable of providing efficient cooling applications thanks to its thermoelectric effects. It is a single-cell module, and has an operating temperature range of 0 to 50°C and a thermal resistance of 8.73°C/W. To achieve maximum power ratings, the module requires that an upper limit of the voltage to the cells be established. The module also has a maximum power rating of 18W, and is capable of maintaining its temperature in most cases.

The 66100-501’s thermoelectric capabilities make it an ideal choice for applications that require cooling. It is most commonly used to cool CPUs, GPUs, FPGAs, and other sensitive components as it is capable of dissipating large amounts of heat. The module’s maximum power rating also makes it suitable for a range of industrial, medical, military, and consumer applications.

The 66100-501 thermoelectric module is an efficient means of cooling thanks to its thermoelectric properties. It is a single-cell module, with an operating temperature range of 0 to 50°C and a thermal resistance of 8.73°C/W. Its maximum power rating is 18W, making it suitable for many industrial, medical, military, and consumer applications. The module is capable of providing efficient cooling, and is most commonly used to cool CPUs, GPUs, FPGAs, and other sensitive components.

The specific data is subject to PDF, and the above content is for reference

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