663652F00000G

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	--
Attachment Method:	Adhesive
Shape:	Rectangular, Pin Fins
Length:	48.000" (1219.20mm)
Width:	1.500" (38.10mm)
Diameter:	--
Height Off Base (Height of Fin):	0.630" (16.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.00°C/W @ 400 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	--

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Thermal - Heat Sinks

Thermal - heat sinks are a vital part of any electronic device. Heat sinks are devices that are designed to dissipate heat from electrical components. The 663652F00000G heat sink is one product in this field designed to provide efficient cooling for a range of electronic applications.The 663652F00000G is designed for a wide range of applications, and is suitable for applications ranging from the smallest of handhelds to the largest of industrial products. It is suitable for high-power components requiring low thermal resistance and can handle a large variety of configurations.The 663652F00000G features a standard but unique construction that makes it suitable for a variety of thermal interchange systems. The design of the heat sink incorporates an efficient heat transfer matrix design, which uses the natural law of thermal convection to increase the rate of heat dissipation from the heat generating components to the heat sink surface.The design of the 663652F00000G provides high thermal conductivity over a wide range of temperatures. The heat sink features an aluminum base plate which is strengthened by corrugated edges, providing a stable and secure connection between the heat generating components and the heat sink base. The thermal conductivity is enhanced by the inclusion of a thermally conductive silicone pad, which is designed to reduce the thermal interface resistance (TIR) between the components and the heat sink base.The 663652F00000G also features an efficient and efficient thermal management system. The thermal management design draws heat away from the heat generating components and dissipates it back into the environment. It does this through several careful design considerations, including the use of convective cooling, heat pipes, or a combination of both.In addition to the thermal management system, the 663652F00000G also utilizes an efficient thermal design. This includes the use of a highly thermally conductive material, which has a high thermal efficiency, allowing greater heat transfer and dissipation.Finally, the 663652F00000G includes a host of mounting options, making it suitable for almost any type of application. With various mounting options, the 663652F00000G can be used in both horizontal and vertical configurations, offering a great deal of versatility.By combining all of these features, the 663652F00000G is an excellent choice for a wide range of applications, providing efficient thermal management and reliable performance. With its unique construction and features, the 663652F00000G is capable of providing cost effective cooling solutions for a wide range of electronic applications.

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