68120-064LF

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68120-064LF rectangular connectors are the ideal solution for board-in, direct-wire-to-board applications. As the board-in technology has been improved, offering more reliable connections and thicker insulation, this type of connector has the best performance for industrial, military, telecommunications, and automotive applications, and a wide variety of other applications.

The 68120-064LF has a 2.5mm pitch, eight-pin, two-row, shielded surface mount socket with locking legs. The solder contacts are on the board side of the connector and the center of the header is relieved to form two flat contacts for board-in latching. A 2.00mm height of the contact allows for typical land patterns on the board. The header features two mounting ears and an integral latch that provides a secure connection in high vibration environments.

The board-in latching provides secure retention of the socket on the board while allowing easy disengagement for socket removal. The socket is constructed in two halves that are sealed with a non-conductive seal material. This helps maintain contact integrity under heavy shock and vibration conditions that may occur in high-density mounting applications. The socket includes a heat-resistant, dielectric rubber ring that allows the contacts to be compressed together and provides a secure electrical connection with minimum damage to the surface of the board.

This type of connector offers a robust and reliable connection that is ideal for harsh environmental conditions. It has a high temperature rating of +105°C and a low temperature rating of -55°C, making it an excellent choice for harsh environments. It has also been tested to meet or exceed industry standards.

The 68120-064LF is the ideal connector for applications that require a high degree of reliability and durability. It has proven to be a reliable connection in a variety of applications and environments. The robust design, high temperature rating, and board-in latching make it an ideal solution for a variety of applications.

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