70203-113LF

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Backplane connectors are a major component of electronic systems. Connecting the electronics of a system without requiring a mechanical connection allows for design flexibility while still ensuring reliable signal and power delivery. In particular, 70203-113LF backplane connectors are an excellent choice because they feature strong shells and contact closures for high data carrying rates in applications needing a permanent connection. In this article, we’ll explore the 70203-113LF backplane connector’s application field and working principle.

The 70203-113LF backplane connector is designed for use in high-reliability environments, such as networks, data centers, telecommunication systems, industrial systems, and medical systems. Its shell materials are rated up to UL 94 V-0, making them perfect for critical applications. Furthermore, its contact plating material ensures an extraordinarily robust connection. This resistance to environmental influences makes them suitable for applications in places where strong ambient influences are present, such as strong electromagnetic fields.

Its main feature is its contact closure. It uses three different contact closures: M, F, and P. The M contact closure uses a standard size pin for both the positive and negative contacts, allowing for high data rates. The F contact closure has an extra-wide contact pin for the positive contact, providing a smaller contact radius than the M contact closure. The P contact closure provides a further improvement in contact radius and allows for contact closure without the use of soldering. This makes the P contact closure ideal for applications at low temperatures where soldering is difficult or impossible.

The 70203-113LF also has excellent resistance to shock and vibrations. Its contact pads feature raised tolerances, giving it a strong resistance to shock. Additionally, the contact closure features a wiper pad design that improves its resistance to vibration – even at higher amplitudes. This makes the 70203-113LF an excellent choice for applications that need to withstand shock, vibration, or strong ambient influences.

In addition to its resilience to environmental influences and vibrations, the 70203-113LF features an optimized contact system. Its contact pins and pads are arranged in a specific pattern to reduce signal integrity loss, reduce crosstalk, and increase the permissible EMC environment. Furthermore, its contact interface pattern is designed to allow for a much larger range of electric signals to be transmitted without significant signal loss.

The 70203-113LF also benefits from the latest materials and processes. Its terminals are designed to be resistant to current fatigue, meaning it can sustain large amounts of current over long periods of time. And its housing materials are thermowell-controlled, allowing it to dissipate heat quickly and efficiently. These features make the 70203-113LF an excellent choice for applications needing rapid and efficient heat dissipation.

The 70203-113LF backplane connector is the perfect solution for applications that need high performance and reliable power and signal delivery. Its features and materials make it an excellent choice for applications needing a robust connection in high-reliability environments such as networks, data centers, telecommunications systems, industrial systems, and medical systems. And because it uses an optimized contact arrangement and thermowell-controlled housing materials, the 70203-113LF is an ideal choice for applications needing rapid and efficient heat dissipation.

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