70V7319S133BC Allicdata Electronics
Allicdata Part #:

70V7319S133BC-ND

Manufacturer Part#:

70V7319S133BC

Price: $ 65.16
Product Category:

Integrated Circuits (ICs)

Manufacturer: IDT, Integrated Device Technology Inc
Short Description: IC SRAM 4.5M PARALLEL 256CABGA
More Detail: SRAM - Dual Port, Synchronous Memory IC 4.5Mb (256...
DataSheet: 70V7319S133BC datasheet70V7319S133BC Datasheet/PDF
Quantity: 1000
12 +: $ 59.22950
Stock 1000Can Ship Immediately
$ 65.16
Specifications
Write Cycle Time - Word, Page: --
Base Part Number: IDT70V7319
Supplier Device Package: 256-CABGA (17x17)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.15 V ~ 3.45 V
Memory Interface: Parallel
Access Time: 4.2ns
Series: --
Clock Frequency: 133MHz
Memory Size: 4.5Mb (256K x 18)
Technology: SRAM - Dual Port, Synchronous
Memory Format: SRAM
Memory Type: Volatile
Part Status: Active
Packaging: Tray 
Description

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The 70V7319S133BC is a memory integrated circuit (IC) which is a product of Micron Technology Inc., an American manufacturer of computer memory. It is a pseudo SRAM, an asynchronous SRAM core with a discrete address and data bus. It is used in a number of applications such as high density memory controllers, memory expansion boards, and embedded FPGA memory.

The 70V7319S133BC is composed of two main components, the Core Logic and the Memory Core. The Core Logic component includes the address and data busses, control logic, counter, registers, and a bus arbiter. The Memory Core component contains the pseudo SRAM memory core. The memory core consists of an array of SRAM cells which can be accessed in parallel or accessed in a serial manner with the same timing cycles.

One of the main advantages of the 70V7319S133BC is that it can be used in many different applications. It can be used to create large density memory controllers, memory expansion boards, and embedded FPGA memories. Additionally, it can be used in more specialized applications such as audio and video applications, power management systems, and data acquisition systems. It can also be used as a high quality memory replacement in many applications.

The 70V7319S133BC is designed to operate synchronously, allowing it to work with the same timing cycles for both parallel and serial instruction cycles. To access memory, the address and data busses will be used. The address and data busses are used to access the memory controller\'s registers, counters, and arbitration logic. This will determine the information that is transmitted to and from the memory. Once the data is transferred, the memory controller will use the control logic to decode the address and data busses and determine where to store the data.

To improve system performance, the 70V7319S133BC has multiple control signals that are transmitted to control the selection, operation, and timing of the memory cycles. These control signals include the Address Bus Ready, Data Bus Ready, Data Bus Valid, and the Select signal. The Address Bus Ready signal is used to indicate the memory controller is ready to receive an address. The Data Bus Ready signal is used to indicate the memory controller is ready to receive data from the address bus. The Data Bus Valid signal is used to indicate that the data is valid and can be used. The Select signal is used to indicate the memory core for selection of the memory cells.

In addition to the address, control, and data busses, the 70V7319S133BC also includes the Memory Core array and the Core Logic. The Memory Core array contains the pseudo SRAM cells which are accessed in parallel or serial with the same timing cycles. The Core Logic is responsible for decoding the address and data busses and determining which cells or chip select signal needs to be sent to."

The 70V7319S133BC is designed to work in many applications and can function with either a synchronous or asynchronous program and data accesses. It has a high level of performance and can be used as a replacement for many different types of memory ICs. Its versatile design and easy to use interface make it an excellent choice for high density memory controller and expansion board applications, as well as embedded FPGA memories.

The specific data is subject to PDF, and the above content is for reference

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