7136DG

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Thermal - Heat Sinks are the preferred solution for dealing with heat generated by electrical and electronic components. The 7136DG is a thermal-enhancement heat sink that helps reduce the temperature of sensitive electronic components, ensuring their long-term reliability and operation.

Application Field

The 7136DG heat sink has one of the widest uses in electronics today, where high power densities and temperatures require a higher level of cooling than air or liquid-based solutions. It provides reliable cooling solutions for a wide range of products, including LED lighting, sensors, printed circuit boards, telecommunications, computers and medical devices.

7136DG heat sinks can also be used as a way of preserving the data stored in semiconductor chips, especially when large data storage capacities are required. In active, passive or hybrid IC cooling designs, they provide a good balance of thermal and acoustic properties. They are also suitable for applications involving multiple processors, as well as those with high frequency and clock rate.

The 7136DG heat sink is also a good choice for industrial applications such as motors and generators, where it will help reduce running temperatures and enhance the performance and lifespan of components.

Working Principle

The 7136DG uses advanced technologies to maintain high performance while minimising thermal resistance, thus reducing the temperature of the electronics it is cooling. It achieves this using a combinational of superior thermal conductivity materials, uniquely designed fins with an enhanced wicking effect and wide surface area and inlet-outlet channels.

The core of the 7136DG is made from a copper alloy which has one of the best thermal conduction coefficients in the industry, ensuring maximum heat transfer. Its combination of fins and enhanced surface area allows the air currents to more efficiently cool the heat sink, while its improved wicking effect helps move heat away from the source components and channels it away faster.

The 7136DG is configured with two types of fins and ridges, which maximise the surface area and simultaneously regulate the surface temperatures. This helps ensure that the heat is dissipated evenly, allowing the heat sink to perform reliably over extended periods of time.

The 7136DG also uses an inlet-outlet channel structure to direct the air within the heat sink and help cool the electronics. Inlet-outlet channels provide increased cooling performance due to their ability to feed more air into the core of the heat sink, which is then dispersed around the core walls, dissipating the heat.

Finally, the 7136DG is designed to be extremely compact, allowing it to be used in difficult installations, such as thin devices. Its design also enables easy installation and servicing, allowing for faster and more efficient cooling.

The 7136DG provides reliable and efficient cooling solutions that allow electronic components and systems to run at maximum speeds without the risk of overheating. Its range of features and benefits make it ideal for a variety of applications, from light emitting diodes and motors to printed circuit boards and data storage.

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