7148DG

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	Multiwatt, SIP
Attachment Method:	Clip and PC Pin
Shape:	Rectangular, Fins
Length:	0.795" (20.19mm)
Width:	0.915" (23.24mm)
Diameter:	--
Height Off Base (Height of Fin):	0.380" (9.65mm)
Power Dissipation @ Temperature Rise:	1.0W @ 30°C
Thermal Resistance @ Forced Air Flow:	6.00°C/W @ 600 LFM
Thermal Resistance @ Natural:	16.00°C/W
Material:	Copper
Material Finish:	Tin

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Thermal – Heat Sinks

A thermal – heat sink is a device, most commonly made of metal, designed to absorb and dissipate heat away from a heated surface, usually an electronic component. Heat sinks are commonly used to keep electronic devices within their desired temperature range, ensuring efficient and reliable operation. Heat sinks are often used in conjunction with fans, as this allows for even greater levels of cooling to be achieved when cooling more heat-intensive components. The 7148DG series of thermal – heat sinks is designed for this exact purpose.

Applications

The 7148DG series is designed for CPUs and other electronic components that generate large amounts of heat, as well as other applications requiring efficient thermal management. Its low profile and light weight make it ideal for cases where space and weight limitations are an issue. It is compatible with VIA Pentium 4, Core2 Duo, and Core2 Quad CPUs, as well as other high-power processors.

Design Features

The 7148DG thermal – heat sink is designed to maximize heat dissipation in tight spaces. The design incorporates a combination of aluminum and thermally conducting compounds for efficient heat transfer. The heat sink base is made from 6063 aluminum alloy with a powder-coated finish to ensure durability and corrosion resistance. The heat sink is constructed with a low-profile fin design for better heat dissipation and is configured with two 6mm copper heat pipes to ensure maximum heat transfer.

Working Principle

The 7148DG thermal – heat sink works by absorbing heat from the surface it is attached to and dissipating it away. Heat is absorbed through the base of the heat sink and conducted along the length of the heat pipes using thermally-conductive compounds. As the heat travels along the heat pipes, it is transferred to the fins of the heat sink, which then dissipate the heat into the surrounding environment.

Advantages

The 7148DG thermal – heat sink offers several key advantages over other thermal management products, including:

• Light-weight and low-profile design, allowing it to fit in tight spaces
• High-efficiency heat dissipation
• High-quality aluminum alloy with durable powder-coated finish
• Dual 6mm copper heat pipes for maximum heat transfer
• Compatible with VIA Pentium 4, Core2 Duo, and Core2 Quad CPUs, as well as other high-power processors

These features make the 7148DG thermal – heat sink an ideal choice for those looking for an efficient and reliable thermal management solution for their electronic components. The device is also exceptionally lightweight, making it well-suited for applications where weight is a major consideration.

Conclusion

The 7148DG thermal – heat sink is an efficient and reliable thermal management solution for CPUs and other heat-intensive electronics. With a lightweight and low profile design, it is easy to install in any system, and the durable aluminum alloy construction ensures reliable performance for years to come. Its combination of efficient heat transfer and superior heat dissipation makes it an ideal option for those looking for effective thermal management in tight spaces.

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