Allicdata Part #: | HS415-ND |
Manufacturer Part#: |
7173DG |
Price: | $ 0.48 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEATSINK .375"TO-220 |
More Detail: | Heat Sink TO-220 Copper 1.5W @ 50°C Board Level, V... |
DataSheet: | 7173DG Datasheet/PDF |
Quantity: | 27700 |
1 +: | $ 0.43470 |
10 +: | $ 0.41454 |
25 +: | $ 0.39388 |
50 +: | $ 0.38342 |
100 +: | $ 0.37825 |
250 +: | $ 0.35237 |
500 +: | $ 0.33163 |
1000 +: | $ 0.30054 |
5000 +: | $ 0.29018 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 0.750" (19.05mm) |
Width: | 0.750" (19.05mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.375" (9.52mm) |
Power Dissipation @ Temperature Rise: | 1.5W @ 50°C |
Thermal Resistance @ Forced Air Flow: | 10.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 25.80°C/W |
Material: | Copper |
Material Finish: | Tin |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 7173DG thermal-heat sink is a device designed to capture and dissipate heat from electronics, machines, and other components, and is primarily used in a variety of applications. It is a common choice for the cooling of electronic components such as CPUs, motherboards, GPUs, and other integrated circuits. The device works by drawing thermal energy away from the component and dissipating it away from the component via heat sinking mechanisms or fan. This thermal management technique helps reduce the component’s temperature, which in turn increases the lifespan and stability of the component.
The 7173DG thermal-heat sink’s heat sinking mechanism is mechanical, which allows it to facilitate the transfer of thermal energy away from the component, as opposed to relying solely on convection or other natural means of air flow. Heat is trapped inside the device using a combination of fins, aerofoil, and channels, and is then released into the surrounding air. This significantly increases the rate of heat dissipation.
The 7173DG thermal-heat sink also features a cooling fan, which helps to draw the heat away from the component and disperse it into the atmosphere. The fan is powered by an internal motor, allowing it to spin and generate a cooling breeze. This method of thermal management is often used in a variety of electronics projects due to its ability to reduce system temperatures and provide efficient cooling.
The 7173DG thermal-heat sink is often used in high-performance PCs, laptops, and other electronics. It is also widely used in industrial applications such as industrial machine cooling, HVAC, and power supplies. This type of heat sink is also perfect for medical devices, home appliances, and consumer electronics, all of which require a steady temperature environment for optimal performance.
In addition to its cooling properties, the 7173DG thermal-heat sink also offers additional benefits, such as being able to reduce noise levels. Since it releases the captured heat away from components, noise levels are kept to a minimum. This is especially useful in applications where noise reduction is essential, such as medical devices and laboratory environments.
For those looking for an effective thermal-heat sink solution, the 7173DG thermal-heat sink is a great option. It offers effective heat dissipation and noise reduction, and is suited for a wide range of applications. It can be used to keep components running at optimal temperatures, which helps to prolong their lifespan and increase their efficacy.
The specific data is subject to PDF, and the above content is for reference
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