76828-149

Series:	--
Packaging:	Bulk
Lead Free Status / RoHS Status:	--
Part Status:	Active
Moisture Sensitivity Level (MSL):	--
Type:	Signal
Pin or Socket:	Pin
Contact Termination:	Press-Fit
Wire Gauge:	--
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)

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Introduction to 76828-149 Backplane Connectors - Contacts

The 76828-149 Backplane Connectors - Contacts is a unique type of connector product line designed specifically to meet the escalating need for high density, high speed and reliable interconnections during backplane applications. With a broad variety of options for contact configurations, contact types, strip lengths and housings material, the 76828-149 is the ideal solution for most backplane applications.

Application Field of 76828-149 Backplane Connectors - Contacts

The 76828-149 Backplane Connectors – Contacts is a high-performance, high-density interconnect system designed to meet the needs of today’s backplane applications. It features low profile, high-power configurations to reduce crosstalk and increase signal integrity. It is designed to withstand the high-performance and thermal requirements of leading edge technologies such as significant current densities, high frequencies, and increasing power as required in modern networking and computing applications. As such, the 76828-149 Backplane Connectors – Contacts is found in a variety of applications including Telecom, Data Center, Enterprise, Industrial, Aerospace and Military.

Working Principles of 76828-149 Backplane Connectors – Contacts

The 76828-149 Backplane Connectors – Contacts employ a unique design based on printed circuit board technology. This includes stamped contacts which have been designed and engineered for optimal performance between the printed circuit board and the contact components. The stamped contacts use either tin or gold plating with a wide range of mating cycles and contact materials available. These components create a reliable and cost effective solution to multiple applications.The contacts are designed to be soldered directly to the printed circuit board, eliminating cost and assembly time. The thermal expansion coefficient is designed to match the board material, eliminating the need for additional components and compressing assembly time. Additionally, the contact is balanced to control differences in CTE (coefficient of thermal expansion) between the board and the contact.Other features of the 76828-149 Backplane Connectors – Contacts include features to reduce EMI (electromagnetic interference) and ensure a strong connection. These features include a recessed socket that allows for a higher contact density, lower contact height for interference reduction, and a multiple insulation construction for superior isolation. The highly efficient contact design also helps manage cost while offering superior performance.

Conclusion

The 76828-149 Backplane Connectors – Contacts is a high-performance, high-density interconnect system designed to meet the needs of today’s backplane applications. It features low profile, high-power configurations to reduce crosstalk and increase signal integrity, as well as recessed sockets to reduce EMI and ensure a strong connection. With a broad variety of options for contact configurations, contact types, strip lengths and housings material, the 76828-149 Backplane Connectors – Contacts is the ideal solution for most backplane applications.

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