Allicdata Part #: | 77427-103LF-ND |
Manufacturer Part#: |
77427-103LF |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | CONN CONTACT PIN COAX RA PCB |
More Detail: | Contact Gold Coaxial Pin, Center Solder |
DataSheet: | 77427-103LF Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | 0.00000 |
Series: | Metral® |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Obsolete |
Moisture Sensitivity Level (MSL): | -- |
Type: | Coaxial |
Pin or Socket: | Pin, Center |
Contact Termination: | Solder |
Wire Gauge: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 51.2µin (1.30µm) |
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Backplane Connector Contacts provide an essential link between various electrical components and other system parts inside a computer system. The 77427-103LF Connector Contact is a robust, cost-effective contact solution designed to meet the needs of high-speed, high-performance, and densely-packed backplanes in a variety of computer connection systems. This contact was developed to fulfill the requirements for interconnections between backplanes and daughterboard-to-daughterboard, as well as between various types of modules in a system.A backplane connection system consists of multiple connectors, each with individual contacts to interconnect multiple boards or modules in the system. Connectors are typically a pair of PCBs, either soldered and hard-mounted on the board or mounted on a removable semiconductor socket. A number of different contacts are used in the system to connect the different parts, such as the 77427-103LF contact.The 77427-103LF Connector Contact features one of the lowest cooperations force available, making it ideal for high-density applications. It is also designed to reduce insertion and extraction forces. The contact design maximizes electrical and mechanical incentives to increase long-term reliability.This contact is designed specifically for use in backplane systems. It is used to connect daughterboards and modules located on either side of the backplane, and to connect the side-by-side boards on the backplane. It is also used to connect multiple boards within the backplane and feed power and signals.The 77427-103LF Connector Contact is designed to work with either standard or lower-pin-count connectors. It is designed to operate in a wide range of environments and temperatures, providing a reliable connection even in extreme conditions. The contact features a low insertion force and contact tension, which allows for easy insertion and extraction of the contacts when needed.The contact has a two-piece construction, with a headpiece and an open bottom, to ensure a strong mechanical and electrical connection. The headpiece is also made from a durable, high-temperature resistant material, providing the contact with increased durability and performance. The contact is also designed with a retention clip to hold it firmly in place within the connector.The contact can be used for a wide range of applications, including power, signal, and ground distributions, as well as for connectivity to any type of board or module. The contact is designed to work well with different board and module designs, as well as with different connector configurations. Additionally, the contact is also compliant with industry standards for safety and performance.With its high-performance design and low cost, the 77427-103LF Connector Contact is ideal for a variety of backplane applications. Its robustness, reliability, and compatibility make it an ideal solution for connecting and powering daughterboards and modules in a system. Its low insertion force and contact tension ensure a reliable connection in extreme operating conditions, while its retention clip ensures a firm and durable connection. With its ability to connect different boards and modules within a system, as well as its industry standards compliance, 77427-103LF Connector Contact is a great choice for high-density backplane applications.
The specific data is subject to PDF, and the above content is for reference
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