780252F00000G Allicdata Electronics
Allicdata Part #:

HS495-ND

Manufacturer Part#:

780252F00000G

Price: $ 70.97
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: 78025 EXTRUSION 1.24X1.54"X4.1'
More Detail: Heat Sink Aluminum Board Level, Vertical
DataSheet: 780252F00000G datasheet780252F00000G Datasheet/PDF
Quantity: 9
1 +: $ 64.51830
10 +: $ 60.48760
25 +: $ 56.45510
50 +: $ 54.43880
100 +: $ 52.42270
Stock 9Can Ship Immediately
$ 70.97
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: --
Attachment Method: PC Pin
Shape: Rectangular, Pin Fins
Length: 49.500" (1257.30mm)
Width: 1.535" (39.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.240" (31.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: --
Description

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780252F00000G is a thermal heat sink designed to dissipate heat from electronic components and circuits effectively. This device is highly efficient in reducing thermal resistance, which makes it ideal for applications in the telecom and military industries. In particular, 780252F00000G is used for dissipating heat from circuits used in high-reliability applications where temperature fluctuations must be kept to a minimum.

The thermal-heat sink is composed of a copper base and a finned surface. The copper base helps to conduct the heat away from the components into the heat sink. The finned surface helps to spread the heat and provide more surface area for the thermal energy to be dissipated. The finned surface also helps to increase the convection of air, which helps to cool the parts efficiently.

The 780252F00000G thermal-heat sink works by transferring thermal energy from the device it is protecting to its environment. The heat is removed as the heat sink absorbs the energy in the form of thermal radiation, convection, and conduction. This helps to protect the device, allowing it to operate at a lower temperature, and thus, improving its reliability and performance.

The 780252F00000G thermal-heat sink is designed with a highly efficient fin design that helps to maximize heat transfer while keeping the fin geometry relatively small. The fins are designed in such a way that the edges of the fin contact area are as close as possible for maximum heat dissipation. The fin design also allows for air flow to be increased to further improve the cooling performance. The fin pitch of the 780252F00000G is also adjustable, allowing for optimum heat transfer from the device.

The 780252F00000G thermal-heat sink is also designed with a unique lamination process. This lamination process helps to eliminate any air gaps between the fins, which helps to ensure that the heat is evenly distributed. As a result, the fins are able to dissipate heat more efficiently, allowing for faster, more efficient cooling.

Overall, the 780252F00000G thermal-heat sink is a reliable and efficient heat sink that is designed to dissipate heat from electronic components and circuits. It is highly efficient in reducing thermal resistance, making it ideal for applications in the telecom and military industries. Its fin design, adjustable fin pitch, and lamination process make it highly efficient in dissipating heat, making it an excellent choice for dissipating high temperatures in high-reliability applications.

The specific data is subject to PDF, and the above content is for reference

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