78089095 RF/IF and RFID

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Automated component assemblies are becoming more and more commonplace in the world of electronics. As such, it is increasingly important that these assemblies meet the criteria for electromagnetic compatibility (EMC)… a measure of the apparatus’s ability to quiet the electromagnetic noise produced by external and internal elements that may interfere with adjacent or other parts of the system. Automated component assemblies must also meet rigorous requirements for radiating and receiving performance. This inevitably raises the question—what strategies can be employed to manage both EMC and RF interference (RFI)?

One solution is the application of Passive Intermodulation (PIM), which is defined as the interaction between two or more signals, in this case from two different RF frequencies, to form one or more summed and/or difference frequencies which can then cause interference. To combat this, assemblies must feature contacts, fingerstock, and gaskets that are shaped, engineered, and chemically treated to support low incidence of PIM. The contact design must also be engineered to minimize optical losses by forming low contact resistances while also reducing stress on the contacts.

When considering contact materials, silver is highly conductive and can lower the contact resistance, but the cost—not to mention the environmental concerns inherent to silver—has made other base materials a viable option. Copper is one such material, offering high conductivity, good strength, and a relatively low-cost solution. Additionally, copper tends to wear better than other materials, reducing the potential for damage caused by temperature or voltage spikes.

As for fingerstock and EMI / RFI gaskets, tin-plated copper is typically the material of choice. Tin provides the advantages of copper for low-resistance characteristrics while also adding superior readability with respect to other metals. In addition, copper-tin fingerstock and gaskets serve to reduce the need for high pressurizing. Tin is also an ideal choice in terms of manufacturing, as it can be easily stamped and formed.

Finally, it’s critical that the contacts, fingerstock, and gaskets be produced with consistent dimensional accuracy throughout the entire production run—not only is this important for EMI / RFI attenuation, but it’s also necessary for tighter fits, which are often required by modern electronic components. Contact geometry and dimensional tolerances, for example, must meet the appropriate manufacturing requirements to achieve the desired performance, reliability, and electrical contact resistance.

In conclusion, a well-engineered automated component assembly should be built with the appropriate contact materials, fingerstock, & gaskets in order to limit EMI / RFI from being generated by parts of the system or from external sources. The components must also meet rigorous requirements for radiating and receiving performance. Through their unique properties, copper-tin contacts, fingerstock & gaskets provide the optimal combination of handling noisy environments while also offering cost and environmental benefits. Thus, these materials should be the first choice for customers looking to meet the necessary EMC and RFI criteria.

The specific data is subject to PDF, and the above content is for reference