| Allicdata Part #: | CR477-ND |
| Manufacturer Part#: |
821102B04000 |
| Price: | $ 0.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Comair Rotron |
| Short Description: | HEATSINK STAMP 9.5X13.2X19.1MM |
| More Detail: | Heat Sink TO-220 Aluminum 1.0W @ 30°C Board Level,... |
| DataSheet: |  821102B04000 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | -- |
| Part Status: | Obsolete |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.750" (19.05mm) |
| Width: | 0.520" (13.21mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.375" (9.52mm) |
| Power Dissipation @ Temperature Rise: | 1.0W @ 30°C |
| Thermal Resistance @ Forced Air Flow: | 12.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Heat sinks are components that absorb and dissipate heat in order to protect electronic devices from overheating. They are widely used in laptops, desktops, servers, and other electronic devices. The 821102B04000 heat sink is designed specifically for use in high-power applications, such as for use by large server systems and blade servers.
This 821102B04000 heat sink is a high-performance passive cooling option. It is made from aluminum alloy and has a profile size of 2U with a mounting width of 160mm and a thickness of 12mm. The 821102B04000 heat sink is designed to be mounted perpendicular to the PCB and is able to dissipate up to 120 Watts of heat with its high thermal conductivity. The heat is transmitted to the air by air convection, which is the process by which air is heated and replaced over time.
The 821102B04000 heat sink is optimized for forced air cooling systems as well as free air systems. In forced-air cooled systems, the air inside the system is circulated and pressurized in order to move more heat away from the device. This allows for a more even temperature distribution, which helps to reduce the chances of heat related failure. In free air systems, the 821102B04000 heat sink is able to dissipate the heat generated by the device by convection, which is much more efficient compared to forced air cooling systems.
The 821102B04000 heat sink is also designed for energy-saving applications. It uses a patented aerodynamic design to enable a faster thermal transport from the device to the air. This helps to reduce the energy consumption and improve the device’s efficiency. It also has a lightweight aluminum alloy construction which enables it to be easily mounted onto any type of device.
The 821102B04000 heat sink is an ideal choice for high-powered applications. Its combination of high thermal conductivity and aerodynamic design make it ideal for use in energy-saving applications, and it is easy to install and maintain. Its lightweight construction also makes it an ideal choice for use in a range of devices, from laptops and desktops to servers and other high-powered applications.
The specific data is subject to PDF, and the above content is for reference
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