Allicdata Part #: | CR494-ND |
Manufacturer Part#: |
821902B00000 |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Comair Rotron |
Short Description: | HEATSINK STAMP 25.4X12.7X30MM |
More Detail: | Heat Sink TO-220 Aluminum 1.0W @ 20°C Board Level,... |
DataSheet: | 821902B00000 Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Obsolete |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.180" (29.97mm) |
Width: | 1.000" (25.40mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 1.0W @ 20°C |
Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are some of the most important tools and processes in the modern technological landscape. They manage the immense amount of heat generated by many different pieces of equipment, and therefore, manage the efficiency of operations. 821902B00000 is a type of heat sink that is meant to combat the effects of heat in more challenging environments. It is designed to be both compact and effective, and is suitable for a wide array of applications.
What is 821902B00000?
821902B00000 is a heat sink specifically designed for cost-sensitive applications. It is physically small but uses materials that are typically found in large-scale heat sinks, so it is able to provide a very reasonable cost per benefit ratio. It also has a greater ability to absorb heat than traditional models, with a copper-based design that includes two limited spans.
821902B00000 is designed with a unique dual-layer structure that helps it to manage temperatures more effectively. While the overall process is similar to other heat sink models, the added layer makes it more effective in extreme conditions. This is because the outer layer is designed for heat abatement, while the inner layer helps to better manage the thermal flow.
Application Field of 821902B00000
821902B00000 is ideal for applications requiring high-performance but with a limited budget. It is also a great choice for space-limited areas due to its compact size. It is highly recommended for medical, military, aerospace, automotive, industrial, and consumer markets.
821902B00000 is used in all kinds of electronic devices, including ones that need to remain within a certain temperature range. It is often used to prevent overheating in larger data-centers and other industrial complexes. Additionally, it can be used to balance the temperature in an office space, or to ensure that an electronic device doesn\'t overheat.
How Does 821902B00000 Work?
The primary function of 821902B00000 is to transfer and disperse the heat that it absorbs, while also preventing it from re-entering the equipment that it came from. This is usually achieved through a process of convection, which is a form of heat transfer where a hot fluid rises and a cooler fluid sinks. This motion sets up a cycle of heat exchange between the 821902B00000 and the surrounding components.
The dual layers of 821902B00000 also help to direct the flow of the hot fluid. The outer layer is designed to absorb the heat and dissipate it outwards while the inner layer helps to eliminate the chances of any heat travelling back into the equipment. This ensures that the device keeps a consistent operating temperature, making it more efficient and reliable.
Conclusion
821902B00000 is a powerful heat sink that is designed for cost-sensitive applications. It is compact and effective, and is suitable for a wide array of applications. Its outer layer is designed to absorb heat while the inner layer helps to better manage the thermal flow. Additionally, it has a greater ability to combat heat than traditional models, making it a great choice for environments that require a higher level of efficiency.
The specific data is subject to PDF, and the above content is for reference
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