Allicdata Part #: | CR499-ND |
Manufacturer Part#: |
822802B00000 |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Comair Rotron |
Short Description: | HEATSINK STAMP 17.8X44.5X9.5MM |
More Detail: | Heat Sink TO-220 Aluminum 2.0W @ 40°C Board Level |
DataSheet: | 822802B00000 Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Obsolete |
Type: | Board Level |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 0.700" (17.78mm) |
Width: | 1.750" (44.45mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.375" (9.52mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 500 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
。Thermal technology has come a long way in recent years, from its small beginnings in simple air-cooled systems, to the most efficient air-cooled systems in the world. In particular, 822802B00000 thermal solutions, also known as heat sinks, are revolutionizing the way heat is managed in both domestic and industrial applications. Heat sinks are constructed from a variety of metallic materials, typically aluminum or copper, and are constructed in several different configurations, depending on the application. They act as a passive cooling solution for users, providing a way to efficiently dissipate heat away from delicate components and maintain their safe operating temperatures.
A 822802B00000 application can be used in all types of applications. In industrial plants and machinery, these heat sinks are often used to control the thermal performance of high power electronics, like CPUs and GPUs. In the enterprise world, 822802B00000 can be used in automated systems, providing vital thermal management for server and storage devices. In most domestic applications, 822802B00000 is usually used in PCs to help keep your processor and other computer parts from getting hot and malfunctioning. It can also help extend the lifespan of components.
The 822802B00000 heat sinks are designed to keep electronic components cool by dissipating heat away from them. Heat dissipation is possible through the use of fins, or extended surfaces that allow heat to disperse away from the electronic components. The fins also act as a heat exchanger, transferring heat away from the component and through the fins. The fins are typically made from aluminum, although they can also be made from copper or other materials. The size and number of fins will depend on the amount of heat that needs to be dissipated, as well as the size of the component. The heat sinks also have small channels or pathways that circulate cooling air, further aiding in heat dissipation.
822802B00000 heat sinks come in a variety of shapes and sizes, and can be custom designed for specific applications. They can also be attached to the heat generating component via an adhesive backing, allowing for easy installation and a secure fit. Most contain thermal paste, which acts as a medium between the heat sink and component, ensuring that a good transfer of heat takes place. Heat sinks are an integral part of many electronics applications, helping to ensure that components remain cool and operate at peak performance.
The 822802B00000 heat sinks are designed to be lightweight and highly efficient, which makes them ideal for a wide range of applications. Their unique design is also cost-effective, making them suitable for both domestic and commercial use. By reducing heat buildup in components, 822802B00000 heat sinks can help to extend the lifespan of electronics and reduce the risk of damage caused by component malfunctioning. As such, they are an important part of many modern electrical and digital systems, and are widely used across both the commercial and domestic sectors.
The specific data is subject to PDF, and the above content is for reference
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